초록 ▼

The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate surface. Conductive lines then couple the conta

The present invention provides for an apparatus and a method for housing an integrated circuit device. The integrated circuit device is coupled to a ceramic substrate wherein contacts of the integrated circuit device mate with contacts on the substrate surface. Conductive lines then couple the contacts to the peripheral edges of the substrate where one set of ends of a lead frame assembly mates with the conductors. An encapsulation technique is used to encapsulate the device, such that only the other set of ends of the lead frame assembly extends from the package. In an alternative embodiment, the integrated circuit is hermetically sealed by having a hermetic cover disposed over the integrated circuit. In a second alternative embodiment, the substrate is capable of having disposed upon it multiple integrated circuits. The present invention provides for a significant increase of lead count to die size ratio.

대표청구항 ▼

An apparatus for housing an integrated circuit (IC), said IC being non-wettable by solder except for certain contact points disposed on the surface of said IC, said apparatus comprising: a substrate having electrical contacts for mounting said IC onto its surface such that said contact points of sai

An apparatus for housing an integrated circuit (IC), said IC being non-wettable by solder except for certain contact points disposed on the surface of said IC, said apparatus comprising: a substrate having electrical contacts for mounting said IC onto its surface such that said contact points of said IC are solder bonded to said electrical contacts of said substrate in a self-aligned manner; said substrate having patterned conductive lines disposed throughout to electrically couple said electrical contacts to terminals disposed around the peripheral edges of said substrate, said conductive lines being sufficiently narrow so as to permit increased lead density; a lead frame having a plurality of leads, each lead having a first end coupled to said terminals around said peripheral edges of said substrate; encapsulating means for encapsulating said IC, substrate, terminals and first ends of said leads, such that only other ends of said leads extend externally off said encapsulating means.