초록 ▼

A method is disclosed for manufacturing multilayer printed circuit boards in which one or more layers thereof, including intermediate layers, may include one or more screened on resistors. The method is particularly well suited for use where large numbers of resistors are required on one or more int

A method is disclosed for manufacturing multilayer printed circuit boards in which one or more layers thereof, including intermediate layers, may include one or more screened on resistors. The method is particularly well suited for use where large numbers of resistors are required on one or more intermediate layers of a multilayer printed circuit board. The method includes the steps of manufacturing individual layers of the multilayer board with electrical circuits thereon and subsequently screening on one or more values of resistors using a polymer thick film resistive ink. Each layer of the multilayer board is cured to dry the polymer thick film resistors. The individual layers are thereafter bonded together into a multilayer board.

대표청구항 ▼

A method for producing a multilayer printed circuit board comprising: (1) generating a first electrical circuit portion on a first substrate comprising a resin impregnated glass fiber matrix; (2) printing a preselected number of resistor elements on said first substrate using a resistive ink compris

A method for producing a multilayer printed circuit board comprising: (1) generating a first electrical circuit portion on a first substrate comprising a resin impregnated glass fiber matrix; (2) printing a preselected number of resistor elements on said first substrate using a resistive ink comprising a mixture of a resin and carbon particles in a solvent; (3) curing the resistive ink to produce a preselected number of resistors having a resistance values; (4) generating at least a second electrical circuit on at least one other substrate also comprising a resin impregnated glass fiber matrix; (5) repeating steps (2) and (3) for the at least one other substrate; and (6) laminating the first and the at least one other substrates to each other to form a multilayer printed circuit board.