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Method and apparatus for aligning solder balls 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-003/06
출원번호 US-0224355 (1988-07-26)
우선권정보 JP-0230406 (1987-09-14)
발명자 / 주소
  • Fukasawa Hideyuki (Hadano JPX) Kobayashi Mamoru (Hadano JPX) Wanami Masahiro (Hadano JPX)
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 109  인용 특허 : 2

초록

Solder balls are supplied onto an aligning plate having aligned through-holes formed therein. Air is sucked from the bottom of the above described aligning plate to fit and attract solder balls into the above described through-holes. Solder balls are thus aligned with high work efficiency.

대표청구항 ▼

A method for aligning solder balls having an outer diameter comprising the steps of: supplying solder balls onto an aligning plate having through-holes formed therein, each of said through-holes having a first hole and a second hole connected to said first hole, said first hole having a slightly lar

이 특허에 인용된 특허 (2)

  1. Bitaillou Alex (Bretigny sur Orge FRX) Masson Jean (Noisy/Ecole FRX) Lemoine Jean-Marie (Saint-Michel-sur-Orge FRX), Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate.
    상세보기
  2. Dyce John W. (Sidney NY) Buczak Ronald F. (Poughkeepsie NY), Solder pack and method of manufacture thereof.
    상세보기

이 특허를 인용한 특허 (109)

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  5. Cobbley, Chad A.; Ball, Michael B.; Waddel, Marjorie L., Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux.
    상세보기
  6. Cobbley, Chad A.; Ball, Michael B.; Waddel, Marjorie L., Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux.
    상세보기
  7. Cobbley, Chad A.; Ball, Michael B.; Waddel, Marjorie L., Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux.
    상세보기
  8. Cobbley,Chad A.; Ball,Michael B.; Waddel,Marjorie L., Apparatus for locating conductive spheres utilizing screen and hopper of solder balls.
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  13. Rathburn, James J., Composite contact for fine pitch electrical interconnect assembly.
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  52. Kee, Kwan Yew; Ngee, Chew Boon; Chiang, Keith Wong Bing, Individual selective rework of defective BGA solder balls.
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  55. Fan Kuang-Shu,TWX, Integrated circuit solder ball implant machine.
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  57. Elco, Richard A.; Lemke, Timothy A.; Houtz, Timothy W., Low cross talk and impedance controlled electrical connector with solder masses.
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  62. Takumi Yamamoto JP; Kazuhiko Futakami JP; Akira Hatase JP; Nobuaki Takahashi JP; Naoji Senba JP; Yuzo Shimada JP, Method and apparatus for lining up micro-balls.
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