$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색도움말
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

통합검색

도움말도움말
상세검색 다국어 입력

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Method and device for cleaning substrates

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B44C-001/22    C03C-015/00    C03C-025/06    B08B-003/12   
미국특허분류(USC) 156/635 ; 134/1 ; 134/30 ; 134/102
출원번호 US-0271307 (1988-11-15)
우선권정보 JP-0292927 (1987-11-19)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 52  인용 특허 : 5
초록

For cleaning substrates in a cleaning device, a reaction furnace of the cleaning device in which a substrate has been installed is evacuated and then supplied with a reducing gas, and a natural oxide film on the substrate is removed by heating it in an atmosphere of reducing gas, the reaction furnace is then is evacuated and a reactive gas is introduced into the reaction furnace, and contaminants on the substrate are removed by etching the substrate in the reactive gas that has been chemically activated by UV radiation.

대표
청구항
▼

A method of cleaning substrates comprising the steps of: (a) evacuating a reaction furnace of a substrate cleaning device in which a substrate has been installed; (b) introducing a reducing gas into said reaction furnace of a substrate cleaning device; (c) removing a natural oxide film on said substrate by heating it in an atmosphere of reducing gas; (d) evacuating said reaction furnace; (e) introducing a reactive gas into said reaction furnace; and (f) removing contaminants on said substrate by etching said substrate in said reactive gas that has been c...

이 특허에 인용된 특허 (5)

  1. Brannon James H. (Hopewell Junction NY). High rate laser etching technique. USP1988034731158.
  2. Dension Dean R. (Los Gatos CA) Hartsough Larry D. (Berkeley CA). Laser induced dissociative chemical gas phase processing of workpieces. USP1981044260649.
  3. Okuhira Hidekazu (Kokubunji JPX) Wada Yasuo (Bunkyo JPX). Manufacturing apparatus for semiconductor devices. USP1987094693779.
  4. Levinstein Hyman J. (Berkeley Heights NJ) Marcus Robert B. (Murray Hill NJ) Murarka Shyam P. (Murray Hill NJ) Wagner Richard S. (Bernardsville NJ). Method of limiting stacking faults in oxidized silicon wafers. USP1979044149905.
  5. Minaee Behrooz (Campbell CA). Photoresist stripping apparatus using microwave pumped ultraviolet lamp. USP1988014718974.

이 특허를 인용한 특허 피인용횟수: 52

  1. Takeshi Aikiyo JP. Airtight sealing method and airtight sealing apparatus for semiconductor laser element. USP2002056396023.
  2. Fayfield Robert T. ; Schwab Brent. Apparatus for processing both sides of a microelectronic device precursor. USP2001096287413.
  3. Butterbaugh,Jeffery W.; Gray,David C.; Fayfield,Robert T.; Siefering,Kevin; Heitzinger,John; Hiatt,Fred C.. Apparatus for surface conditioning. USP2006047025831.
  4. Birtcher, Charles Michael; Martinez, Martin Castaneda; Steidl, Thomas Andrew; Vivanco, Gil; Silva, David James. Cabinet for chemical delivery with solvent purging. USP2005106953047.
  5. Birtcher,Charles Michael; Martinez,Martin Castaneda; Steidl,Thomas Andrew; Vivanco,Gil; Silva,David James. Cabinet for chemical delivery with solvent purging and removal. USP2008027334595.
  6. Butterbaugh Jeffery W. ; Gray David C.. Cleaning method. USP1998025716495.
  7. Butterbaugh Jeffery W. ; Gray David C. ; Fayfield Robert T.. Cleaning method. USP2000096124211.
  8. Grant, Robert W.; Ruzyllo, Jerzy; Torek, Kevin. Controlled etching of oxides via gas phase reactions. USP200507RE38760.
  9. Todd, Michael A.. Deposition of amorphous silicon-containing films. USP2014128921205.
  10. Todd, Michael A.. Deposition over mixed substrates using trisilane. USP2009067547615.
  11. Fayfield Robert T. ; Schwab Brent. Equipment for UV wafer heating and photochemistry. USP2000126165273.
  12. Fayfield, Robert T.; Schwab, Brent. Equipment for UV wafer heating and photochemistry. USP2003126663792.
  13. Okumura Katsuya (Yokohama JPX) Moriya Takahiko (Yokohama JPX) Miyazaki Shinji (Yokohama JPX) Kumagai Yoshio (Kofu JPX) Tanaka Susumu (Hachioji JPX). Film forming method and film forming device. USP1991055015330.
  14. Beinglass Israel. In situ method for cleaning silicon surface and forming layer thereon in same chamber. USP2001036197694.
  15. Belcher James F. ; Whicker Stephen L.. Infrared-sensitive conductive-polymer coating. USP2000066080987.
  16. Pomarede, Christophe F.; Givens, Michael E.; Shero, Eric J.; Todd, Michael A.. Integration of high k gate dielectric. USP2010097790556.
  17. Pomarede,Christophe F.; Givens,Michael E.; Shero,Eric J.; Todd,Michael A.. Integration of high k gate dielectric. USP2006047026219.
  18. Gupta Anand ; Rana Virendra V. S. ; Verma Amrita ; Bhan Mohan K. ; Subrahmanyam Sudhakar. Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface. USP2000096121163.
  19. Gupta Anand ; Rana Virendra V. S. ; Verma Amrita ; Bhan Mohan K. ; Subrahmanyam Sudhakar. Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface. USP2001096291028.
  20. Gupta Anand ; Rana Virendra V. S. ; Verma Amrita ; Bhan Mohan K. ; Subrahmanyam Sudhakar. Method and apparatus for improving the film quality of plasma enhanced CVD films at the interface. USP2001096289843.
  21. Anand Gupta. Method and apparatus for reducing particle contamination in a substrate processing chamber. USP2002106465043.
  22. Gupta Anand. Method and apparatus for reducing particle contamination in a substrate processing chamber. USP2000106139923.
  23. Gupta Anand ; Wolff Stefan ; Galiano Maria. Method and apparatus for reducing particle generation by limiting DC bias spike. USP1999055902494.
  24. Butterbaugh Jeffery W. ; Gray David C. ; Fayfield Robert T. ; Siefering Kevin ; Heitzinger John ; Hiatt Fred C.. Method and apparatus for surface conditioning. USP2000016015503.
  25. Lewis Paul. Method for improving lubricating surfaces on disks. USP2001036204504.
  26. Lewis Paul E.. Method for improving lubricating surfaces on disks. USP2000086099762.
  27. Izumi Akira (Kyoto JPX) Toei Keiji (Kyoto JPX) Watanabe Nobuatsu (Kyoto JPX) Chong Yong-Bo (Kyoto JPX). Method for removing a film on a silicon layer surface. USP1991065022961.
  28. Silberberg, Eric; Michel, Eric; Reniers, Francois; Buess-Herman, Claudine. Method for the plasma cleaning of the surface of a material coated with an organic substance and the installation for carrying out said method. USP2014118877003.
  29. Okonogi Kensuke,JPX. Method of cleaning a surface of a semiconductor substrate by a heat treatment in an inert gas atmosphere. USP1998125849102.
  30. Kapolnek Michael R. (Sunnyvale CA) Feild Alexander R. (Mt. View CA) Hartle Robert T. (Cupertino CA) Holmes Hillard R. (Menlo Park CA). Method of fabricating a graded-groove heat pipe. USP1991024989319.
  31. Jeffery W. Butterbaugh ; Brent Schwab. Method of surface preparation. USP2002106465374.
  32. Herbots, Nicole; Bradley, James; Shaw, Justin Maurice; Culbertson, Robert J.; Atluri, Vasudeva. Methods for preparing semiconductor substrates and interfacial oxides thereon. USP2010127851365.
  33. Herbots, Nicole; Whaley, Shawn; Culbertson, Robert; Bennett-Kennett, Ross; Murphy, Ashlee; Bade, Matthew; Farmer, Sam; Hudzietz, Brance. Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization. USP2017039589801.
  34. Herbots, Nichole; Bennett-Kennett, Ross; Murphy, Ashlee; Hughes, Brett; Acharya, Ajjya; Watson, Clarizza; Culbertson, Robert. Methods for wafer bonding, and for nucleating bonding nanophases. USP2016089418963.
  35. Herbots, Nicole; Culbertson, Robert J.; Bradley, James; Hart, Murdock Allen; Sell, David Alexander; Whaley, Shawn David. Methods for wafer bonding, and for nucleating bonding nanophases. USP2015049018077.
  36. Todd, Michael A.. Process for deposition of semiconductor films. USP2011118067297.
  37. Todd, Michael A.; Hawkins, Mark. Process for deposition of semiconductor films. USP2013018360001.
  38. Butterbaugh Jeffery W. ; Gray David C.. Process for metals removal using beta-diketone or beta-ketoimine ligand forming compounds. USP1998075782986.
  39. Steidl, Thomas Andrew; Vivanco, Gildardo; Birtcher, Charles Michael. Purgeable container for low vapor pressure chemicals. USP2005116966348.
  40. Birtcher, Charles Michael; Martinez, Martin Castaneda; Steidl, Thomas Andrew; Vivanco, Gil; Silva, David James. Purgeable manifold for low vapor pressure chemicals containers. USP2003116648034.
  41. Ishizaka, Tadahiro; Mizuno, Shigeru. Radiation-assisted selective deposition of metal-containing cap layers. USP2014058716132.
  42. Secord, Tyrone. Recliner clutch mechanism for vehicle seat. USP2005036869143.
  43. Geusic, Joseph E.; Reinberg, Alan R.. Removal of copper oxides from integrated interconnects. USP2003066579803.
  44. Geusic,Joseph E.; Reinberg,Alan R.. Removal of copper oxides from integrated interconnects. USP2006087084067.
  45. Joseph E. Geusic ; Alan R. Reinberg. Removal of copper oxides from integrated interconnects. USP2002026348125.
  46. Inaba Yutaka (Hyogo JPX) Kobayashi Kiyoteru (Hyogo JPX). Silicon nitride film formation method. USP1997055629043.
  47. Voloshin George Oleg ; Zorich Robert Sam. Solvent purge mechanism. USP2000106138691.
  48. Voloshin George Oleg ; Zorich Robert Sam. Solvent purge mechanism. USP1999105964230.
  49. Khan Ashraf R. ; Ramanathan Sasangan ; Foggiato Giovanni Antonio. Surface modification of semiconductors using electromagnetic radiation. USP2000016015759.
  50. Belcher James F. ; Whicker Stephen L.. System and method for making a conductive polymer coating. USP2000076083557.
  51. Powell,Don Carl. System and method for selectively increasing surface temperature of an object. USP2007077247584.
  52. Todd, Michael A.; Raaijmakers, Ivo. Thin films and methods of making them. USP2011027893433.

IPC 상위 출원인