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A multilayer printed circuit board in which multiple layers of a composite material, fabricated by the lay-up of an aramid fiber tape, are employed to provide a circuit board with a desired coefficient of thermal expansion. Tape lay-up of aramid fibers provides a composite layer having a lower therm

A multilayer printed circuit board in which multiple layers of a composite material, fabricated by the lay-up of an aramid fiber tape, are employed to provide a circuit board with a desired coefficient of thermal expansion. Tape lay-up of aramid fibers provides a composite layer having a lower thermal coefficient of expansion than a composite layer fabricated from woven aramid fibers. Degradation in the tensile modulus of elasticity caused by the over and under characteristics of woven fabrics is also eliminated by tape lay-up, thus providing a circuit board with better mechanical strength. In addition, tape lay-up reduces the amount of resin required to fabricate the circuit board and eliminates the need for twisting the aramid fibers into yarns and then weaving the yarns, thus reducing the cost of the circuit board.

대표청구항 ▼

A method for fabricating a multilayer printed circuit board, comprising the steps of: forming a plurality of layers of a composite material by lay-up of an aramid fiber tape, each composite layer including a plurality of layers of the aramid fiber tape; plating at least one side of some of the compo

A method for fabricating a multilayer printed circuit board, comprising the steps of: forming a plurality of layers of a composite material by lay-up of an aramid fiber tape, each composite layer including a plurality of layers of the aramid fiber tape; plating at least one side of some of the composite layers with a layer of copper; etching the copper layers with predefined circuit patterns; and laminating the composite layers with insulating adhesive layers to form a printed circuit board having a coefficient of thermal expansion that is approximately equal to that of the electrical components to be mounted on the circuit board.