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특허 상세정보

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내보내기 페이스북 공유 카카오톡 공유

Mounting for printed circuits forming a heat sink with controlled expansion

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20    B32B-003/00   
미국특허분류(USC) 361/386 ; 156/634 ; 165/185 ; 174/685
출원번호 US-0205960 (1988-06-13)
우선권정보 FR-0008372 (1987-06-16)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 43  인용 특허 : 4
초록

A mounting that forms a heat sink for printed circuit boards comprising a graphite core oriented by compression to obtain very high lateral thermal conductivity and relatively low density is disclosed. This core is held by two outer skins made up of folds of carbon fibers embedded in an epoxy resin matrix. A metallic frame made of invar makes the mounting rigid, thus giving mountings that conduct heat very well while at the same time being light.

대표
청구항

A mounting for printed circuits, said mounting forming a heat sink having low heat expansion characteristics, comprising: (i) a central graphite layer made of compressed graphite sheets having a lateral thermal conductivity greater than 200 W/m.°C. and a density lower than 1.4; said sheets consisting essentially of particles highly oriented in the plane of each sheet; and (ii) two outer layers, each made of carbon fibers bound together by a resin matrix, said outer layers displaying a high Young\modulus and sandwiching the central graphite layer.

이 특허에 인용된 특허 (4)

  1. Davidson Lewis A. (Reston VA) Duffy Michael C. (Vienna VA) Erickson Alvard J. (Reston VA) Gunther-Mohr Gerard R. (Chappaqua NY) Williams Richard A. (Candor NY). Functional package for complex electronic systems with polymer-metal laminates and thermal transposer. USP1976043952231.
  2. Dtzer Richard (Nuremberg DEX) Lechner Ernst-Friedrich (Erlangen DEX). Heat-removing circuit boards. USP1985014495378.
  3. Leibowitz Joseph D. (Culver City CA). Method of fabricating multilayer printed circuit board structure. USP1987084689110.
  4. Jensen Warren M. (Kirkland WA). Printed wiring board substrates for ceramic chip carriers. USP1982034318954.

이 특허를 인용한 특허 피인용횟수: 43

  1. Vasoya, Kalu K.. Build-up printed wiring board substrate having a core layer that is part of a circuit. USP2016089408314.
  2. Vasoya, Kalu K.. Build-up printed wiring board substrate having a core layer that is part of a circuit. USP2012068203080.
  3. Spacie, Christopher John; Davies, Robert Kellson; Stirling, Christopher Anthony. Carbon materials. USP2011108034451.
  4. Pfister Dennis M. ; Byrd Charles M.. Circuit board having an integral sorber. USP1999115992168.
  5. Hill, Richard F.; Smythe, Robert Michael. Compliant multilayered thermally-conductive interface assemblies. USP2015129222735.
  6. Southard, II, John L.. Composite heat spreader containing synthetic graphite sheet and compressed graphite layer joined without adhesive. USP2016029267745.
  7. Reis, Bradley E.; Smalc, Martin David; Laser, Brian J.; Kostyak, Gary Stephen; Skandakumaran, Prathib; Getz, Matthew G.; Frastaci, Michael. Cycling LED heat spreader. USP2009087573717.
  8. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael. Cycling LED heat spreader. USP2008047365988.
  9. Knowles, Timothy R.; Seaman, Christopher L.. Dendritic fiber material. USP2005076913075.
  10. Knowles,Timothy R.; Seaman,Christopher L.. Dendritic fiber material. USP2006127144624.
  11. Schreffler Gary J.. Electronic component assembly and method for low cost EMI and capacitive coupling elimination. USP2000016011691.
  12. Ali M. Akbar ; Peterson Carl W. ; McNab Kevin M.. Electronic structure having an embedded pyrolytic graphite heat sink material. USP2000066075701.
  13. Knowles,Timothy R.; Seaman,Christopher L.. Fiber adhesive material. USP2006117132161.
  14. Schneider, Douglas; Davis, William E.. Graphene-based thermal management cores and systems and methods for constructing printed wiring boards. USP2016059332632.
  15. Fourie, Daniel. Graphite layer between carbon layers. USP2016099442514.
  16. Norley, Julian; Tzeng, Jing-Wen; Klug, Jeremy. Graphite-based heat sink. USP2003016503626.
  17. Krassowski, Daniel W.; Chen, Gary G.. Heat dissipating component using high conducting inserts. USP2004076758263.
  18. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael. Heat spreaders with vias. USP2007127303005.
  19. Reis, Bradley E.; Cartiglia, James R.. Heat spreading circuit assembly. USP2011027889502.
  20. Ford,Brian M.; Shives,Gary D.; Norley,Julian; Reynolds, III,Robert Anderson. Integral heat spreader. USP2007017161809.
  21. Tzeng,Jing Wen; Krassowski,Daniel Witold. Isolated thermal interface. USP2007017166912.
  22. Reis,Bradley E.; Cartiglia,James R.. LED with integral via. USP2009037505275.
  23. Vasoya, Kalu K.; Mangrolia, Bharat M.; Davis, William E.; Bohner, Richard A.. Lightweight circuit board with conductive constraining cores. USP2009127635815.
  24. Hill, Richard F.; Smythe, Robert Michael. Memory modules including compliant multilayered thermally-conductive interface assemblies. USP2014098837151.
  25. Davidson,Howard. Method and apparatus for making a sorber. USP2006027003979.
  26. Smalc, Martin D.. Method for making finned heat sink assemblies. USP2005056886249.
  27. Bootle John D. ; Burzesi Frank. Method of making thermal core material and material so made. USP1999105962348.
  28. Gary J. Schreffler. Plated through-holes for signal interconnections in an electronic component assembly. USP2002066400570.
  29. Schulz, Martin. Power semiconductor module assembly with heat dissipating element. USP2012128324720.
  30. Okano Norio,JPX ; Kobayashi Kazuhito,JPX ; Nakaso Akishi,JPX. Prepreg for printed circuit board. USP1999105965245.
  31. Jang, Chang-soo; Won, Dong-kwan; Roh, Hyoung-ho; Ryu, Jae-chul. Printed circuit board and method of manufacturing the same. USP2010107811626.
  32. Jang,Chang soo; Won,Dong kwan; Roh,Hyoung ho; Ryu,Jae chul. Printed circuit board and method of manufacturing the same. USP2008127470461.
  33. Vasoya, Kalu K.. Processes for manufacturing printed wiring boards. USP201507RE45637.
  34. Vasoya, Kalu K.. Processes for manufacturing printed wiring boards. USP2010067730613.
  35. Smalc, Martin D.. Radial finned heat sink. USP2003036538892.
  36. Fujiwara Norio,JPX ; Akiba Yasuhiro,JPX ; Watanabe Tetsuyuki,JPX ; Nishiki Naomi,JPX. Thermal conductive unit and thermal connection structure using the same. USP2001076257328.
  37. Jing Wen Tzeng. Thermal management system. USP2002116482520.
  38. Tzeng, Jing-Wen. Thermal management system. USP2005016841250.
  39. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson. Thermal solution for electronic devices. USP2006016982874.
  40. Smalc,Martin David; Shives,Gary D.; Reynolds, III,Robert Anderson. Thermal solution for portable electronic devices. USP2007117292441.
  41. Herzl Alfred. Thermally conductive support structure. USP2000086102112.
  42. Chen, Ko-Chun; Lin, Chiu-Lang. Use of a graphite heat-dissipation device including a plating metal layer. USP2015089097468.
  43. Chen, Ko-Chun; Lin, Chiu-Lang. Use of a graphite heat-dissipation device including a plating metal layer. USP2015028955580.

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