초록 ▼

A mounting that forms a heat sink for printed circuit boards comprising a graphite core oriented by compression to obtain very high lateral thermal conductivity and relatively low density is disclosed. This core is held by two outer skins made up of folds of carbon fibers embedded in an epoxy resin

A mounting that forms a heat sink for printed circuit boards comprising a graphite core oriented by compression to obtain very high lateral thermal conductivity and relatively low density is disclosed. This core is held by two outer skins made up of folds of carbon fibers embedded in an epoxy resin matrix. A metallic frame made of invar makes the mounting rigid, thus giving mountings that conduct heat very well while at the same time being light.

대표청구항 ▼

A mounting for printed circuits, said mounting forming a heat sink having low heat expansion characteristics, comprising: (i) a central graphite layer made of compressed graphite sheets having a lateral thermal conductivity greater than 200 W/m.°C. and a density lower than 1.4; said sheets consistin

A mounting for printed circuits, said mounting forming a heat sink having low heat expansion characteristics, comprising: (i) a central graphite layer made of compressed graphite sheets having a lateral thermal conductivity greater than 200 W/m.°C. and a density lower than 1.4; said sheets consisting essentially of particles highly oriented in the plane of each sheet; and (ii) two outer layers, each made of carbon fibers bound together by a resin matrix, said outer layers displaying a high Young\modulus and sandwiching the central graphite layer.