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Electronic packaging of components incorporating a ceramic-glass-metal composite 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-001/04
  • H01L-023/28
출원번호 US-0924970 (1986-10-30)
발명자 / 주소
  • SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL)
출원인 / 주소
  • Olin Corporation (New Haven CT 02)
인용정보 피인용 횟수 : 69  인용 특허 : 13

초록 ▼

The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic

대표청구항 ▼

A semiconductor casing, comprising: a base component and a lid component both formed from a ceramic-glass-metal composite material, said composite material having a structure comprising substantially a matrix of said glass with said ceramic and metal particles dispersed therein, said composite mater

이 특허에 인용된 특허 (13)

  1. Frampton Thomas J. (Poway CA), Ceramic package system using low temperature sealing glasses.
    상세보기
  2. Butt Sheldon H. (Godfrey IL) Cann William F. (Ladue MO), Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs.
    상세보기
  3. Butt Sheldon H. (Godfrey IL), Composites of glass-ceramic to metal seals and method of making the same.
    상세보기
  4. Dumesnil Maurice E. (Palo Alto CA) Schreier Ulrich (San Mateo CA), Glass sealed products.
    상세보기
  5. Butt Sheldon H. (Godfrey IL), Low thermal expansivity and high thermal conductivity substrate.
    상세보기
  6. Chirino Agustin M. (Elmira NY) Yost Gerald H. (Corning NY), Method of forming hermetic seals.
    상세보기
  7. Butt Sheldon H. (Godfrey IL), Method of making low thermal expansivity and high thermal conductivity substrate.
    상세보기
  8. Butt Sheldon H. (Godfrey IL), Multi-layer circuitry.
    상세보기
  9. Ushifusa Nobuyuki (Hitachi JPX) Ogihara Satoru (Hitachi JPX) Noro Takanobu (Yokohama JPX), Multilayered ceramic circuit board.
    상세보기
  10. Butt Sheldon H. (Godfrey IL), Reinforced glass composites.
    상세보기
  11. Nair Kumaran M. (East Amherst NY), Resistor compositions.
    상세보기
  12. Dumesnil Maurice E. (Palo Alto CA) Schreier Ulrich (San Francisco CA), Sealing glass composition.
    상세보기
  13. Howell Robert G. (Boone NC), Temperature sensitive electrical element, and method and material for making the same.
    상세보기

이 특허를 인용한 특허 (69)

  1. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Adhesive applications using alkali silicate glass for electronics.
    상세보기
  2. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
    상세보기
  3. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D., Alkali silicate glass based coating and method for applying.
    상세보기
  4. Sampica, James D.; Barnidge, Tracy J.; Tchon, Joseph L.; Lower, Nathan P.; Wilcoxon, Ross K.; Dudley, Sandra S., Alkali silicate glass for displays.
    상세보기
  5. Ohkawa Yoshihiro,JPX ; Ikeda Makoto,JPX ; Miyahara Kenichiro,JPX ; Itoh Yoshiaki,JPX, Aluminum nitride substrate and process for preparation thereof.
    상세보기
  6. Mattox Douglas M. (Rolla MO), Aluminum nitride-compatible thick-film binder glass and thick-film paste composition.
    상세보기
  7. Lower, Nathan P.; Nemeth, Paul R.; Wilcoxon, Ross K., Antiglare treatment for glass.
    상세보기
  8. Bhatt Ashwinkumar C. (Endicott NY) Duffy Thomas P. (Endicott NY) Hackett Gerry A. (Apalachin NY) McKeveny Jeffrey (Endicott NY), Apparatus for laminating and circuitizing substrates having openings therein.
    상세보기
  9. Young, Dianna M., Articles sealed with glass.
    상세보기
  10. Horn Stuart B. ; Nelson Elizabeth H., Barrier layers for thin film electronic materials.
    상세보기
  11. Liang, Jiuh-Ming; Nieh, Kai-Wei, Battery with protective packaging.
    상세보기
  12. Glenn, Thomas P.; Hollaway, Roy D.; Webster, Steven, Ceramic semiconductor package and method for fabricating the package.
    상세보기
  13. Horiguchi Akihiro,JPX ; Sumino Hiroyasu,JPX ; Kasori Mitsuo,JPX ; Ueno Fumio,JPX, Circuit board with high strength and high reliability and process for preparing the same.
    상세보기
  14. Bloom Terry, Copper ink for aluminum nitride.
    상세보기
  15. Hoffman Paul R. ; Popplewell James M. ; Braden Jeffrey S., Edge connectable metal package.
    상세보기
  16. Mahulikar Deepak (Madison CT), Electronic package with improved electrical performance.
    상세보기
  17. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Electronic packaging of components incorporating a ceramic-glass-metal composite.
    상세보기
  18. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R.; Dlouhy, David W., Fabrication process for a flexible, thin thermal spreader.
    상세보기
  19. Hideaki Nakai JP; Hirofumi Sunahara JP; Sadaaki Sakamoto JP, Glass ceramic board.
    상세보기
  20. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
    상세보기
  21. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.; Wyckoff, Nathaniel P.; Hamilton, Brandon C., Glass thick film embedded passive material.
    상세보기
  22. Yamamoto, Masaharu; Hira, Junji, Hermetic sealing cap.
    상세보기
  23. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
    상세보기
  24. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P., Integrated circuit protection and ruggedization coatings and methods.
    상세보기
  25. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K., Integrated circuit tampering protection and reverse engineering prevention coatings and methods.
    상세보기
  26. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  27. Ahmad,Syed Sajid, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  28. Syed Sajid Ahmad, Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  29. Shih, Tung-Hsiu; Nieh, Kai Wei; Krasnov, Victor; Liang, Jiuh-Ming, Laminated lithium battery.
    상세보기
  30. Shih, Tung-Hsiu; Nieh, Kai Wei; Krasnov, Victor; Liang, Jiuh-Ming, Lithium battery having low leakage anode.
    상세보기
  31. Liang, Jiuh-Ming, Localized heat treatment of battery component films.
    상세보기
  32. Shkel, Andrei A.; Efimovskaya, Alexandra; Senkal, Doruk, Low cost wafer level process for packaging MEMS three dimensional devices.
    상세보기
  33. Goodelle, Jason P.; Gabriel, Kaigham J., MEMS device including a chip carrier.
    상세보기
  34. Wilcoxon, Ross K.; Lower, Nathan P.; Wooldridge, James R.; Dlouhy, David W.; Strzelczyk, Anthony J., Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid.
    상세보기
  35. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  36. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  37. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  38. Bolken, Todd O., Method and apparatus for packaging a microelectronic die.
    상세보기
  39. Yglesia Larry G. ; Occhipinti Joseph S. ; Steddom Clark M., Method for creating a hermetic seal and package made thereby.
    상세보기
  40. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
    상세보기
  41. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K., Method for providing near-hermetically coated integrated circuit assemblies.
    상세보기
  42. Wilcoxon, Ross K.; Lower, Nathan P.; Boone, Alan P., Method for providing near-hermetically coated, thermally protected integrated circuit assemblies.
    상세보기
  43. Ahmad, Syed Sajid, Method of Interconnecting substrates for electrical coupling of microelectronic components.
    상세보기
  44. Bhatt Ashwinkumar C. (Endicott NY) Duffy Thomas P. (Endicott NY) Knight Jeffrey A. (Endwell NY) Walsh James P. (Vandling PA), Method of construction for multi-tiered cavities used in laminate carriers.
    상세보기
  45. Cobbley,Chad A., Method of encapsulating interconnecting units in packaged microelectronic devices.
    상세보기
  46. Cobbley,Chad A., Method of encapsulating packaged microelectronic devices with a barrier.
    상세보기
  47. Goodelle, Jason P.; Gabriel, Kaigham J., Method of fabricating MEMS device.
    상세보기
  48. Sylvester Mark F., Method of making a lid for a chip/package system.
    상세보기
  49. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K., Method of reinforcing a hermetic seal of a module.
    상세보기
  50. Bolken, Todd O., Microelectronic devices and microelectronic die packages.
    상세보기
  51. Mahulikar Deepak (Madison CT) Tyler Derek E. (Cheshire CT) Braden Jeffrey S. (Livermore CA) Popplewell James M. (Guilford CT), Molded plastic semiconductor package including heat spreader.
    상세보기
  52. Umeda Yuhji (Nagoya JPX) Otagiri Tadashi (Nagoya JPX) Suzuki Go (Nagoya JPX), Multilayered ceramic substrate fireable in low temperature.
    상세보기
  53. Bhaduri, Sutapa; Manulyk, Olexsander, Nanocomposite material.
    상세보기
  54. Lavallee, Guy P.; Catchmark, Jeffrey M., Optical, optoelectronic and electronic packaging platform, module using the platform, and methods for producing the platform and the module.
    상세보기
  55. Cobbley, Chad A., Packaged microelectronic devices with interconnecting units.
    상세보기
  56. James, Stephen L.; Cobbley, Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  57. James,Stephen L.; Cobbley,Chad A., Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices.
    상세보기
  58. Nieh, Kai Wei; Liang, Jiuh-Ming; Krasnov, Victor, Plasma deposition on a partially formed battery through a mesh screen.
    상세보기
  59. Shih, Tung-Hsiu; Nieh, Kai Wei; Krasnov, Victor, Pulsed mode apparatus with mismatched battery.
    상세보기
  60. Liang, Jiuh-Ming; Nieh, Kai Wei, Solid-state lithium battery with electrolyte.
    상세보기
  61. Nieh, Kai Wei; Liang, Jiuh-Ming; Krasnov, Victor, Sputtering lithium-containing material with multiple targets.
    상세보기
  62. Lower, Nathan P.; Wilcoxon, Ross K.; Yao, Qizhou; Dlouhy, David W.; Chihak, John A., System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling.
    상세보기
  63. Cripe, David W.; McCoy, Bryan S.; Lower, Nathan P.; Wilcoxon, Ross K., System and method for proportional cooling with liquid metal.
    상세보기
  64. Farnworth, Warren M., Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece.
    상세보기
  65. Wilcoxon, Ross K.; Dlouhy, David W.; Lower, Nathan P.; Wooldridge, James R., Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections.
    상세보기
  66. Liang, Jiuh-Ming, Thin film battery and localized heat treatment.
    상세보기
  67. Liang, Jiuh-Ming; Nieh, Kai Wei, Thin film battery packaging formed by localized heating.
    상세보기
  68. Krasnov, Victor; Nieh, Kai-Wei, Thin film battery with electrical connector connecting battery cells.
    상세보기
  69. Lower, Nathan P.; Wilcoxon, Ross K.; Wooldridge, James R., Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader.
    상세보기

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