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Apparatus on the carousel principle for coating substrates 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C23C-014/56
출원번호 US-0196724 (1988-05-20)
우선권정보 DE-3735284 (1987-10-17)
발명자 / 주소
  • Anderle Friedrich (Hanau am Main DEX) Costescu Dan L. (Hainburg DEX) Kempf Stefan (Alzenau DEX) Novak Emmerich (Obertshausen DEX) Zejda Jaroslav (Rodenbach DEX)
출원인 / 주소
  • Leybold Aktiengesellschaft (Cologne DEX 03)
인용정보 피인용 횟수 : 50  인용 특허 : 2

초록

A rotatable substrate holder (6) which has a plurality of substrate pickups in a circular arrangement at equal distances apart is disposed in a vacuum chamber (1). A corresponding number of substrates are driven stepwise on a circular path from an air lock station (8, 9) through at least one coating

대표청구항

Apparatus according to the carousel principle for the coating of substrates, with a vacuum chamber and a rotatable substrate holder disposed therein, which has in equidistant distribution and in circular arrangement a plurality of substrate pickups, adjacent pickups being angularly separated by a pi

이 특허에 인용된 특허 (2)

  1. Denton Peter R. (Cherry Hill NJ) Boyarsky David (Cherry Hill NJ), Apparatus for coating compact disks.
  2. Boyarsky David (Cherry Hill NJ) Vaughan Robert T. (Cheltenham PA), Apparatus for coating substrate devices.

이 특허를 인용한 특허 (50)

  1. Slater Daniel A. (Rochester NY) Kline Patrick J. (Rochester NY) Marowski Robert E. (Rochester NY), Apparatus and method for cooling hot disk-shaped objects.
  2. Maeda Kazuo (Tokyo JPX) Ohira Kouichi (Tokyo JPX) Chino Hiroshi (Tokyo JPX), Apparatus for manufacturing semiconductor device.
  3. Brauer Gunter,DEX ; Kloberdanz Hermann,DEX ; Lotz Hans-Georg,DEX ; Schneider Jochen,DEX ; Zoller Alfons,DEX ; Hagedorn Harro,DEX ; Konig Michael,DEX ; Meinel Jurgen,DEX ; Teschner Gotz,DEX, Apparatus for the coating of substrates in a vacuum chamber.
  4. Hanaguri Koji,JPX ; Tsuji Kunihiko,JPX ; Nomura Homare,JPX ; Tamagaki Hiroshi,JPX ; Kawaguchi Hiroshi,JPX ; Shimojima Katsuhiko,JPX ; Fujii Hirofumi,JPX ; Kido Toshiya,JPX ; Suzuki Takeshi,JPX ; Inou, Arc ion plating device and arc ion plating system.
  5. Hansen Mark, Carousel pin stacker.
  6. Schertler Roman,ATX, Chamber, at least for the transport of workpieces, a chamber combination, a vacuum treatment facility as well as a trans.
  7. Schertler Roman,ATX, Chamber, at least for the transport of workpieces, a chamber combination, a vacuum treatment facility as well as a transport method.
  8. Johnson,Wayne L., Chuck transport method and system.
  9. Avi Tepman ; Donald J. K. Olgado ; Allen L. D'Ambra, Dual buffer chamber cluster tool for semiconductor wafer processing.
  10. Kraus, Joseph Arthur; Strassner, James David, Dual wafer load lock.
  11. Yokoyama Natsuki,JPX ; Kawamoto Yoshifumi,JPX ; Murakami Eiichi,JPX ; Uchida Fumihiko,JPX ; Mizuishi Kenichi,JPX ; Kawamura Yoshio,JPX, Fabrication system and fabrication method.
  12. Yokoyama, Natsuki; Kawamoto, Yoshifumi; Murakami, Eiichi; Uchida, Fumihiko; Mizuishi, Kenichi; Kawamura, Yoshio, Fabrication system and fabrication method.
  13. Yokoyama,Natsuki; Kawamoto,Yoshifumi; Murakami,Eiichi; Uchida,Fumihiko; Mizuishi,Kenichi; Kawamura,Yoshio, Fabrication system and fabrication method.
  14. Yokoyama,Natsuki; Kawamoto,Yoshifumi; Murakami,Eiichi; Uchida,Fumihiko; Mizuishi,Kenichi; Kawamura,Yoshio, Fabrication system and fabrication method.
  15. Yokoyama,Natsuki; Kawamoto,Yoshifumi; Murakami,Eiichi; Uchida,Fumihiko; Mizuishi,Kenichi; Kawamura,Yoshio, Fabrication system and fabrication method.
  16. Yokoyama Natsuki,JPX ; Kawamoto Yoshifumi,JPX ; Murakami Eiichi,JPX ; Uchida Fumihiko,JPX ; Mizuishi Kenichi,JPX ; Kawamura Yoshio,JPX, Fabrication system and method having inter-apparatus transporter.
  17. Yokoyama Natsuki,JPX ; Kawamoto Yoshifumi,JPX ; Murakami Eiichi,JPX ; Uchida Fumihiko,JPX ; Mizuishi Kenichi,JPX ; Kawamura Yoshio,JPX, Fabrication system and method having inter-apparatus transporter.
  18. Hashimoto Hajime (Kyoto JPX) Kubota Kazuo (Kyoto JPX) Inoue Daisuke (Kyoto JPX) Nogawa Syuichi (Kyoto JPX), Film forming apparatus.
  19. Ken Lee ; Ke Ling Lee ; Mingwei Jiang ; Robert M. Martinson, Horizontal sputtering system.
  20. Hofmeister, Christopher; Caveney, Robert T., Linear substrate transport apparatus.
  21. Kawaura Hiroshi,JPX, Low-pressure processing device.
  22. Olin, Stefan, Machine and method for manufacturing compact discs.
  23. Yoshimura Yoshinori,JPX ; Iwasaki Masaaki,JPX, Magnetron sputtering apparatus and mask.
  24. Ding, Peijun; Xu, Zheng; Zhang, Hong; Tang, Xianmin; Gopalraja, Praburam; Rengarajan, Suraj; Forster, John C.; Fu, Jianming; Chiang, Tony; Yao, Gongda; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y., Metal / metal nitride barrier layer for semiconductor device applications.
  25. Baumecker Tomas,DEX ; Grimm Helmut,DEX ; Henrich Jurgen,DEX ; Michael Klaus,DEX ; Rodling Gert,DEX ; Ulrich Jurgen,DEX, Method and device for transporting cylindrical substrates to be coated.
  26. Willson, Richard F.; Roberts, Gregory D., Method for a tray exchange during continuous production of disks.
  27. Chiang, Tony; Yao, Gongda; Ding, Peijun; Chen, Fusen E.; Chin, Barry L.; Kohara, Gene Y.; Xu, Zheng; Zhang, Hong, Method for depositing a diffusion barrier layer and a metal conductive layer.
  28. Schertler Roman (Wolfurt ATX), Method for masking a workpiece and a vacuum treatment facility.
  29. Ding,Peijun; Xu,Zheng; Zhang,Hong; Tang,Xianmin; Gopalraja,Praburam; Rengarajan,Suraj; Forster,John C.; Fu,Jianming; Chiang,Tony; Yao,Gongda; Chen,Fusen E.; Chin,Barry L.; Kohara,Gene Y., Method of depositing a tantalum nitride/tantalum diffusion barrier layer system.
  30. Bright Nick ; Mooring Ben, Modular architecture for semiconductor wafer fabrication equipment.
  31. Tepman Avi, Monolith processing system platform.
  32. Baccini, Andrea; Galiazzo, Marco; Andreola, Daniele; De Santi, Luigi; Zorzi, Christian; Vercesi, Tommaso, Next generation screen printing system.
  33. Todd Craig B. ; Yu James E., Process chamber lid.
  34. Kim Daehwan D., Process chamber tray.
  35. Dubs,Martin; Schertler,Roman, Sputter chamber as well as vacuum transport chamber and vacuum handling apparatus with such chambers.
  36. Kok Ronaldus J.C.M.,NLX ; Landsbergen Jeroen F.M.,NLX ; Visser Jan,NLX, Sputtering method in multi-chambered device.
  37. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  38. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  39. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  40. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  41. Hofmeister, Christopher; Caveney, Robert T., Substrate processing apparatus.
  42. Fujino, Yutaka, Substrate processing system.
  43. Lee Ke Ling ; Mazur Mikhail ; Lee Ken ; Martinson Robert M., System and method for handling and masking a substrate in a sputter deposition system.
  44. Ke Ling Lee ; Mikhail Mazur ; Ken Lee ; Robert M. Martinson, System and method for transporting and sputter coating a substrate in a sputter deposition system.
  45. Tepman Avi, Transfer chamber.
  46. Yasar Tugrul ; Robison Rodney Lee ; Deyo Daniel ; Zielinski Marian, Transport system for wafer processing line.
  47. Takahashi, Seiichi; Miyaya, Takehisa; Lim, Soo Boo; Satou, Masayuki; Tsutsumi, Kengo; Ono, Yohei, Vacuum processing apparatus.
  48. Ikeda, Jiro; Takizawa, Yoji, Vacuum processing device.
  49. Patz, Ulrich; Ickes, Gerd, Vacuum treatment apparatus for deposition of thin layers on three-dimensional substrates.
  50. Kloss,Ingo, Workpiece feeder device for an electron beam processing device.
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