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Metal-polymer adhesion by low energy bombardment

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05D-003/06
출원번호 US-0281960 (1988-12-06)
발명자 / 주소
  • Clabes Joachim G. (Yorktown Heights NY) Hahn Peter O. (Burghausen NY DEX) Ho Paul S. (Chappaqua NY) Lefakis Haralambos (San Jose CA) Rubloff Gary W. (Katonah NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 26  인용 특허 : 3

초록

A technique is described for improving metal-organic substrate adhesion and for reducing stress between the metal film and the substrate. Low energy reactive ions, electrons, or photons are incident upon the substrate to alter the surface chemistry of the substrate to a depth of from about 10 angstr

대표청구항

A method for improving metal adhesion to an organic substrate, including the steps of: irradiating a surface of said substrate with low energy particles, said particles being selected from the group consisting of reactive ions, electrons and photons, wherein said reactive ions and electrons have ene

이 특허에 인용된 특허 (3)

  1. Ehrbar Jean-Paul (La Chaux-de-Fonds CHX) Ganguillet Claude (Neuchatel CHX), Method of preparation of a substrate made of plastic material for its subsequent metallization.
  2. Mirtich, Michael J.; Sovey, James S.; Banks, Bruce A., Oxidation protection coatings for polymers.
  3. Shirahata Ryuji (Odawara JPX) Kitamoto Tatsuji (Odawara JPX) Suzuki Masaaki (Odawara JPX) Amari Hiroshi (Odawara JPX), Process for the production of a magnetic recording medium.

이 특허를 인용한 특허 (26)

  1. Bergkessel Nicholas E. ; Bergstresser Tad ; Chiang Shiuh-Kao ; Prokop Mary K. ; Russell David B., Adhesiveless flexible laminate and process for making adhesiveless flexible laminate.
  2. Ringeisen,Bradley R.; Barron,Jason; Wu,Peter; Krizman,David B.; Darfler,Marlene M., Biological laser printing for tissue microdissection via indirect photon-biomaterial interactions.
  3. Barron,Jason; Ringeisen,Bradley R.; Kim,Heungsoo; Wu,Peter, Biological laser printing via indirect photon-biomaterial interactions.
  4. Tan Minshen ; Tan Swie-In, Deposition of insulating thin film by a plurality of ion beams.
  5. Nguyen Tue ; Charneski Lawrence J. ; Hsu Sheng Teng, Differential copper deposition on integrated circuit surfaces and method for same.
  6. Woodard F. Eugene ; Pass Thomas ; Larsen Ted L., Double-sided reflector films.
  7. Swisher Richard L., Metal-film laminate resistant to delamination.
  8. Scheckenbach Helmut,DEX ; Frank Georg,DEX, Metallizing thermoplastics.
  9. Seryogin, Georgiy; Tetreault, Thomas G.; Golovato, Stephen N.; Chandrasekaran, Ramya, Method for increasing adhesion of copper to polymeric surfaces.
  10. Watanabe,Seiichi; Shinozaki,Kenji; Kohno,Minoru; Mitsuhashi,Hiroyuki; Tonosaki,Minehiro; Kobayashi,Masato, Method for processing the surface of an insulating article, printer head and substrate for recording medium.
  11. Edwards David L. ; Coico Patrick A. ; Iruvanti Sushumna ; Pompeo Frank L. ; Sherif Raed A. ; Toy Hilton T., Method for providing a thermal path through particles embedded in a thermal cap.
  12. Matienzo Luis J. ; Blackwell Kim J. ; Egitto Frank D. ; Knoll Allan R., Method of forming adherent metal components on a polyimide substrate.
  13. Matienzo Luis J. ; Blackwell Kim J. ; Egitto Frank D. ; Knoll Allan R., Method of forming adherent metal components on a polyimide substrate.
  14. Kiuchi Masato,JPX ; Chayahara Akiyoshi,JPX, Method of forming transparent and conductive ultrathin films.
  15. Kim, Dong Sun; Kim, Taehoon; Song, Jong Seok; Her, Sam Jin; Park, Jun Heyoung, Method of manufacturing printed circuit board.
  16. Yu, Shui; Wu, Zi-bao; Zhou, Hai-xia; Lee, Min-Zen, Method of preparing double-layer antimicrobial coating.
  17. Ziegler,John P.; Piner,John R., Oand HO barrier material.
  18. Gul, S. Asim, Photo expansion gas detector.
  19. Kim, Dong Sun; Kim, Taehoon; Song, Jong Seok; Her, Sam Jin; Park, Jun Heyoung, Printed circuit board and fabricating method of the same.
  20. Blackwell Kim Joseph ; Chen Pei Cheh ; Knoll Allan Robert ; Matienzo Luis Jesus ; Weale Richard Dean, Process for coating a substrate with metallic layer.
  21. Eugen Beck LI; Jurgen Ramm CH; Heinrich Zimmermann CH, Process for manufacturing coated plastic body.
  22. Nohr Ronald Sinclair ; MacDonald John Gavin, Process of enhanced chemical bonding by electron seam radiation.
  23. Tonosaki, Minehiro; Takei, Yutaka; Okita, Hiroyuki; Horino, Yuji; Chayahara, Akiyoshi; Kinomura, Atsushi; Tsubouchi, Nobuteru, Surface hardened resins for disk substrates, methods of manufacture thereof and production devices for the manufacture thereof.
  24. Pavel Koulik CH; Evgenia Zorina CH, Surface treatment method and device therefor.
  25. Edwards David L. ; Coico Patrick A. ; Iruvanti Sushumna ; Pompeo Frank L. ; Sherif Raed A. ; Toy Hilton T., Thermal cap with embedded particles.
  26. Anschel Morris (Wappingers Falls NY) Ormond Douglas W. (Wappingers Falls NY) Hayunga Carl P. (Poughkeepsie NY), Thin film metallization process for improved metal to substrate adhesion.
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