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Multiple electrode plasma reactor power distribution system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05B-031/26
출원번호 US-0097592 (1987-09-15)
발명자 / 주소
  • Rough J. Kirkwood H. (264 S. 14th St. San Jose CA 95112) Rose Peter W. (1000 Almanor Ave. Menlo Park CA 94025)
인용정보 피인용 횟수 : 95  인용 특허 : 4

초록

A multiple electrode plasma reactor power circuit that utilizes a power splitting device, such as a center-tapped coil, to deliver balanced power to a plurality of powered electrodes. Balanced plasmas are thereby created between powered electrodes and grounded electrodes. In a preferred embodiment a

대표청구항

A multiple electrode plasma reactor power circuit comprising: an RF generator; a matching network being electrically connected to said RF generator; at least one reaction chamber having a total of at least two powered electrodes disposed within said chambers and at least one grounded surface dispose

이 특허에 인용된 특허 (4)

  1. Gabor Gabriel (La Celle Saint Cloud FRX), High power electric generator, especially adapted for powering processes involving discharge in a rarified atmosphere.
  2. Maher, Jr., Joseph A.; Zafiropoulo, Arthur W., Multi-planar electrode plasma etching.
  3. Morley John R. (54 Golden Ave. Medford MA 02155), Plasma generator.
  4. Reavill Joseph A. (Mira Loma CA), Uniform plasma etching system.

이 특허를 인용한 특허 (95)

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  45. Henley, Francois J., Layer transfer of films utilizing controlled propagation.
  46. Henley, Francois J., Layer transfer of films utilizing controlled shear region.
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  53. Henley, Francois J., Method and structure for fabricating solar cells using a thick layer transfer process.
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  80. Henley, Francois J.; Brailove, Adam, Race track configuration and method for wafering silicon solar substrates.
  81. Henley Francois J. ; Cheung Nathan W., Reusable substrate for thin film separation.
  82. Henley Francois J. ; Cheung Nathan W., Silicon-on-silicon hybrid wafer assembly.
  83. Henley, Francois J.; Cheung, Nathan W., Silicon-on-silicon hybrid wafer assembly.
  84. Henley Francois J. ; Cheung Nathan W., Silicon-on-silicon wafer bonding process using a thin film blister-separation method.
  85. Matsushita, Atsushi, Simultaneous discharge apparatus.
  86. Moriceau, Hubert; Aspar, Bernard; Margail, Jacques, Stacked structure and production method thereof.
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  89. Henley, Francois; Lamm, Al; Chow, Yi-Lei, Substrate cleaving under controlled stress conditions.
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  92. Karlquist, Richard Keith; Savas, Stephen Edward; Weisse, Robert Eugene, System and method for distributing RF power to a plasma source.
  93. Chan, Chung, System for the plasma treatment of large area substrates.
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  95. Brailove, Adam; Liu, Zuqin; Henley, Francois J.; Lamm, Albert J., Techniques for forming thin films by implantation with reduced channeling.
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