초록 ▼

Heat conducting laminates and laminated heat conducting devices having at least one layer of metal and at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material distributed throughout and embedded therein. The coefficient of thermal expansion and the t

Heat conducting laminates and laminated heat conducting devices having at least one layer of metal and at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material distributed throughout and embedded therein. The coefficient of thermal expansion and the thermal conductivity of the laminated heat conducting devices are defined by the metal in combination with the polymer matrix material and the low-thermal-expansion reinforcing material in the laminate. The coefficient of thermal expansion and thermal conductivity of a heat conducting device can be controlled by bonding at least one layer of metal to at least one layer of polymer matrix composite material having low-thermal-expansion reinforcing material distributed throughout and embedded therein. In one embodiment, the laminated heat conducting device comprises a plurality of alternating layers of aluminum and epoxy resin having graphite fibers distributed throughout the epoxy resin.

대표청구항

A heat conducting laminate comprising at least one layer of metal and at least one layer of thermoset polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein.

A heat conducting laminate comprising at least one layer of metal and at least one layer of thermoset polymer matrix composite material having low-thermal-expansion reinforcing material embedded therein.