초록 ▼

A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadf

A semiconductor package for an electrical component which has a metal or metal alloy leadframe with first and second surface, which leadframe is adapted to have an electrical component connected thereto. The leadframe is bonded by means of a polymer to a copper or copper alloy base member. The leadframe is also bonded by means of a polymer to a copper or copper alloy cap member. The cap and base members have coated to their inside surfaces a metal or metal alloy. The coating improves the polymer bond between the leadframe and the base and cap members. The surface area of the base member is increased to transfer more heat from the silicon chip in the semiconductor package and to reduce the thermal stresses between the silicon chip and the base member.

대표청구항 ▼

A semiconductor package for housing an electrical component comprising: a metal or metal alloy leadframe having first and second opposite surfaces and adapted to have said electrical component connected thereto; a copper or copper alloy base member having first and second opposite surfaces with side

A semiconductor package for housing an electrical component comprising: a metal or metal alloy leadframe having first and second opposite surfaces and adapted to have said electrical component connected thereto; a copper or copper alloy base member having first and second opposite surfaces with sides there between; a copper or copper alloy cap member having first and second opposite surfaces with sides there between; said base and cap members having a metal or metal alloy coating selected from the group consisting of: nickel, tin, cobalt, chromium, molybdenum, tungsten, titanium, zirconium, hafnium, niobium, tantalum, germanium, aluminum and alloys of the foregoing metals on at least a first surface of each; and a polymer coating bonding said first coated surface of said base member to said first coated surface of said cap member, said leadframe embedded in said polymer component and disposed between said base and cap member.