초록 ▼

A microchannel heat sink used to cool a high power electronic device such as an integrated circuit comprising a plurality of channels in close thermal contact to the integrated circuit and through which a liquid is passed to create either a developing laminar flow or a turbulent flow. The turbulent

A microchannel heat sink used to cool a high power electronic device such as an integrated circuit comprising a plurality of channels in close thermal contact to the integrated circuit and through which a liquid is passed to create either a developing laminar flow or a turbulent flow. The turbulent flow may be either developing or fully developed. The heat sink features a compensation heater surrounding the integrated circuit and heated at the same rate as the integrated circuit to thereby provide a more uniform temperature at the perimeter of the integrated circuit.

대표청구항 ▼

A method of using a microchannel heat sink to cool a high power device such as an integrated circuit, said method comprising the steps of: forcing a fluid into an input port of said microchannel heat sink; passing said fluid through a plurality of channels in said microchannel heat sink to create a

A method of using a microchannel heat sink to cool a high power device such as an integrated circuit, said method comprising the steps of: forcing a fluid into an input port of said microchannel heat sink; passing said fluid through a plurality of channels in said microchannel heat sink to create a turbulent flow through said channels, said channels having a width between 125 and 300 micrometers, and being in thermal contact with said high power device to thereby transfer heat from said high power device to said fluid; and discharging said fluid from said microchannel heat sink to thereby dissipate said heat.