초록 ▼

Option-equippable apparatus such as a computer that is not fully equipped with option circuit boards (14) has filler boards (15,16) connected to free board slots (13). In one embodiment, the filler boards (15) simulate the effect of circuit boards on airflow and act to evenly distribute the cooling

Option-equippable apparatus such as a computer that is not fully equipped with option circuit boards (14) has filler boards (15,16) connected to free board slots (13). In one embodiment, the filler boards (15) simulate the effect of circuit boards on airflow and act to evenly distribute the cooling air flow inside the computer cabinet (10) in order to provide improved cooling of the circuit boards. In another embodiment, the filler boards (16) block airflow between filler boards connected to adjacent board slots to direct more cooling airflow to any slots equipped with option circuit boards. The filler boards are made of electrically-conductive material (30) to absorb electromagnetic radiation emissions, and are covered with acoustically-absorbent material (33) to absorb sound emissions of the apparatus.

대표청구항 ▼

An arrangement for use with an electronic apparatus providing a plurality of slots, each slot for connection to the apparatus of an optional circuit package, the arrangement for connecting to a slot of the plurality of slots instead of the optional circuit package, the arrangement being a dummy opti

An arrangement for use with an electronic apparatus providing a plurality of slots, each slot for connection to the apparatus of an optional circuit package, the arrangement for connecting to a slot of the plurality of slots instead of the optional circuit package, the arrangement being a dummy optional circuit package having protrusions extending therefrom toward adjacent slots across a direction of coolant flow to block the flow of the coolant between two adjacent slots when the arrangement and an identical arrangement are connected one to each of the two adjacent slots.