초록 ▼

A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as

A tool employing a solder foot to deposit solder on a series of conductive surfaces as the tool moves. In one embodiment, non-wettable blade attached to the tool breaks the film. A pair of sensors coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an omnidirectional tool for deposition.

대표청구항 ▼

Apparatus for depositing solder on a series of separated conductive surfaces comprising: a housing having means defining a reservoir for liquid solder and means defining an outlet for liquid solder in the form of a foot from said reservoir. means for sensing the position of the liquid solder foot em

Apparatus for depositing solder on a series of separated conductive surfaces comprising: a housing having means defining a reservoir for liquid solder and means defining an outlet for liquid solder in the form of a foot from said reservoir. means for sensing the position of the liquid solder foot emerging from said outlet, and means for breaking a solder film existing between said liquid solder foot and one of said separated conductive surfaces.