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Method and system for fluid treatment of semiconductor wafers 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/02
출원번호 US-0283465 (1988-12-12)
발명자 / 주소
  • McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA)
출원인 / 주소
  • CFM Technologies, Inc. (Lionville PA 02)
인용정보 피인용 횟수 : 77  인용 특허 : 10

초록

A system for the fluid treatment of semiconductor wafers includes a treatment vessel having opposed first and second ports, and means for holding wafers in a flow path therebetween. A flow segment comprising in sequence, a first vent, a first valve, an inlet, a second valve and a second vent extends

대표청구항

Apparatus for treatment of semiconductor wafers with a fluid comprising: a treatment vessel having means for receiving a flow of fluid and means for supporting at least one wafer in contact with the fluid, fluid supply means for providing a measured supply of treatment fluid to the vessel, the fluid

이 특허에 인용된 특허 (10)

  1. Blackwood Robert S. (Chanhassen MN), Apparatus for and method of cleaning and removing static charges from substrates.
  2. Walsh Robert J. (Ballwin MO), Apparatus for processing semiconductor wafers.
  3. McConnell Christopher F. (Gulph Mills PA) Walter Alan E. (Exton PA), Apparatus for treating semiconductor wafers.
  4. McConnell Christopher F. (978 S. Gulph Rd. Gulph Mills PA 19406) Walter Alan E. (606 Brecknock Dr. Exton PA 19341), Method and system for fluid treatment of semiconductor wafers.
  5. McConnell Christopher F. (Two Soldiers Field Park Boston MA 02163), Method of treating wafers with fluid.
  6. Johnson ; Jr. Anderson F. (Sinking Spring PA) Stork Edward L. (Ephrata PA) Winings Richard H. (St. Lawrence PA), Methods for treating articles.
  7. Blackwood Robert S. (Chanhassen MN), Positive developing method and apparatus.
  8. Rasmussen Soren W. (Copenhagen DKX), Process and apparatus for the treatment of samples with a succession of liquids.
  9. McConnell Christopher F. (978 S. Gulph Rd. Gulph Mills PA 19406), Vessel and system for treating wafers with fluids.
  10. McConnell Christopher F. (978 S. Gulph Rd. Gulph Mills PA 19406), Vessel and system for treating wafers with fluids.

이 특허를 인용한 특허 (77)

  1. Huh Dong-Chul,KRX ; Jung Chang-Yong,KRX, Apparatus and method for cleaning semiconductor devices without leaving water droplets.
  2. Bergman, Eric J.; Hess, Mignon P., Apparatus and method for delivering a treatment liquid and ozone to treat the surface of a workpiece.
  3. Bergman Eric J. ; Hess Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
  4. Bergman Eric J. ; Hess Mignon P., Apparatus and method for processing the surface of a workpiece with ozone.
  5. Taft, Charles J.; McCullough, Kenneth J.; Ouimet, George F.; Rath, David L.; Zigner, Jr., Robert W., Apparatus and method for wet cleaning.
  6. Matthews Robert Roger, Apparatus for the treatment and drying of semiconductor wafers in a fluid.
  7. Matthews Robert Roger, Apparatus for the treatment of semiconductor wafers in a fluid.
  8. Radha Nayak ; Yezdi Dordi ; Joseph Stevens ; Peter Hey, Apparatus with etchant mixing assembly for removal of unwanted electroplating deposits.
  9. Kert Dolechek, Chemical solutions system for processing semiconductor materials.
  10. Gotoh, Hideto; Niuya, Takayuki; Mori, Hiroyuki; Matsunaga, Hiroshi; Ishihara, Fukusaburo; Kimura, Yoshiya; Sotoaka, Ryuji; Goto, Takuya; Aoyama, Tetsuo; Abe, Kojiro, Cleaning agent and cleaning method.
  11. Randall Frederick ; Raven ; III Alfred J., Cleaning apparatus with solution flushing system for tubes and other articles.
  12. Rayandayan,Ronald; Verhaverbeke,Steven; Wang,Hong, Cleaning method and solution for cleaning a wafer in a single wafer process.
  13. Verhaverbeke, Steven; Truman, J. Kelly, Cleaning method and solution for cleaning a wafer in a single wafer process.
  14. Verhaverbeke,Steven; Truman,J. Kelly, Cleaning method and solution for cleaning a wafer in a single wafer process.
  15. Verhaverbeke,Steven; Truman,Kelly, Cleaning method and solution for cleaning a wafer in a single wafer process.
  16. Gotoh, Hideto; Niuya, Takayuki; Mori, Hiroyuki; Matsunaga, Hiroshi; Ishihara, Fukusaburo; Kimura, Yoshiya; Sotoaka, Ryuji; Goto, Takuya; Aoyama, Tetsuo; Abe, Kojiro, Cleaning method using an oxidizing agent, chelating agent and fluorine compound.
  17. Freeman Alex ; Ramamurthi Ram, Device and fluid separator for processing spherical shaped devices.
  18. Oshinowo John,DEX, Device for treating substrates in a fluid container.
  19. McConnell Christopher F. ; Verhaverbeke Steven, Electroless metal deposition of electronic components in an enclosable vessel.
  20. Delehanty Donald John ; Jagannathan Rangarajan ; McCullough Kenneth John ; Miura Donna Diane ; Ouimet ; Jr. George F. ; Rath David Lee ; Rhoads Bryan Newton ; Schmidt ; Jr. Frank John, Etching composition and use thereof.
  21. Rath David L. ; Jagannathan Rangarajan ; McCullough Kenneth J. ; Okorn-Schmidt Harald F. ; Madden Karen P. ; Pope Keith R., Etching of silicon nitride.
  22. Vargason Rick D. (Boise ID), Liquid in situ multiport monitoring system.
  23. Komiya, Hiroshi; Eshima, Kazuyoshi, Liquid processing apparatus, liquid processing method, and storage medium that stores computer program for implementing liquid processing method.
  24. Clark R. Scot ; Baird Stephen S. ; Hoffman Joe G., Manufacture of high precision electronic components with ultra-high purity liquids.
  25. Clark, R. Scot; Baird, Stephen S.; Hoffman, Joe G., Manufacture of high precision electronic components with ultra-high purity liquids.
  26. Verhaverbeke,Steven; Truman,J. Kelly; Endo,Rick R.; Ko,Alexander, Method and apparatus for chemical mixing in a single wafer process.
  27. Dryer, Paul William; Tirendi, Richard Scott; Sundin, James Bradley, Method and apparatus for immersion treatment of semiconductor and other devices.
  28. Harada Shigeru,JPX ; Yamashita Takashi,JPX ; Fujiki Noriaki,JPX ; Tanaka Tsutomu,JPX, Method and apparatus for manufacturing a semiconductor integrated circuit.
  29. Harada Shigeru,JPX ; Yamashita Takashi,JPX ; Fujiki Noriaki,JPX ; Tanaka Tsutomu,JPX, Method and apparatus for manufacturing a semiconductor integrated circuit.
  30. Adhiprakasha, Edwin; Huang, Shuogang, Method and apparatus for preventing native oxide regrowth.
  31. Jolley, Michael, Method for cleaning copper surfaces.
  32. Bran, Mario E., Method for megasonic processing of an article.
  33. Verhaverbeke, Steven, Method for reducing particle contamination during the wet processing of semiconductor substrates.
  34. Bran, Mario E., Method of manufacturing integrated circuit devices.
  35. Verhaverbeke Steven ; DiBello Gerald N. ; McConnell Christopher F., Methods and systems for determining chemical concentrations and controlling the processing of semiconductor substrates.
  36. Bergman Eric J., Methods for cleaning semiconductor surfaces.
  37. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  38. Bergman, Eric J., Methods for cleaning semiconductor surfaces.
  39. Ferrell Gary W. ; Spencer Thomas D., Methods for drying and cleaning objects using aerosols.
  40. Ferrell Gary W. ; Spencer Thomas D. ; Carter Rob E., Methods for drying and cleaning of objects using aerosols and inert gases.
  41. Alan E. Walter, Methods for treating objects.
  42. Walter Alan E., Methods for treating objects.
  43. Verhaverbeke Steven, Methods for treating semiconductor wafers.
  44. Bergman,Eric J., Methods of thinning a silicon wafer using HF and ozone.
  45. Hoffman Joe G. ; Clark R. Scot, On-site ammonia purification for semiconductor manufacture.
  46. Bedge, Satish, Passivation for cleaning a material.
  47. Bedge, Satish, Passivation for cleaning a material.
  48. Bedge, Satish, Passivation for cleaning a material.
  49. Grootegoed James A. ; Vanell James F., Point of use dilution tool and method.
  50. Hoffman Joe G. ; Clark R. Scot, Point-of-use ammonia purification for electronic component manufacture.
  51. Gerald N. DiBello, Pressure relief device and method of using the same.
  52. Bergman, Eric J., Process and apparatus for treating a workpiece such as a semiconductor wafer.
  53. Bergman,Eric J., Process and apparatus for treating a workpiece with gases.
  54. Rath David L. ; Jagannathan Rangarajan ; McCullough Kenneth J. ; Okorn-Schmidt Harald F. ; Madden Karen P. ; Pope Keith R., Process for removing etching residues, etching mask and silicon nitride and/or silicon dioxide.
  55. Matthews Robert Roger, Process for treatment of semiconductor wafers in a fluid.
  56. Steven Verhaverbeke ; Lewis Liu ; Alan Walter ; C. Wade Sheen ; Christopher McConnell, Processes for treating electronic components.
  57. Bergman,Eric J., Processing a workpiece using water, a base, and ozone.
  58. Jagannathan Rangarajan ; Madden Karen P. ; McCullough Kenneth J. ; Okorn-Schmidt Harald F. ; Pope Keith R. ; Rath David L., Removal of dielectric oxides.
  59. Yates, Donald L.; Morgan, Paul A., Removal of organic material in integrated circuit fabrication using ozonated organic acid solutions.
  60. Gale Glenn W. ; Jagannathan Rangarajan ; Madden Karen P. ; McCullough Kenneth J. ; Okorn-Schmidt Harald F. ; Pope Keith R. ; Rath David L., Removal of silicon oxide.
  61. Lai Kuei-Hsi,TWX ; Cheng Ching-Chih,TWX ; Ma Hung-Lung,TWX, Rinsing system used in a photoresist coater with capability to avoid a reversed pressure effect.
  62. Rath David L. ; Jagannathan Rangarajan ; McCullough Kenneth J. ; Okorn-Schmidt Harald F. ; Madden Karen P. ; Pope Keith R., Selective removal of etching residues.
  63. Han Suk Bin,KRX ; Huh Yun Jun,KRX, Semiconductor wafer cleaning apparatus.
  64. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning method.
  65. Michael B. Olesen ; Mario E. Bran, Semiconductor wafer cleaning system.
  66. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning system.
  67. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning system.
  68. Olesen Michael B. ; Bran Mario E., Semiconductor wafer cleaning system.
  69. You, Dong-Jun; Oh, Jong-Woon, Semiconductor wafer washing system and method of supplying chemicals to the washing tanks of the system.
  70. Pagliaro, Jr., Robert H., Silicon surface preparation.
  71. Pagliaro, Jr.,Robert H., Silicon surface preparation.
  72. Pagliaro, Jr., Robert H.; Doty, Mitchell L.; King, Diane M., Stable, oxide-free silicon surface preparation.
  73. Huh Yun Jun,KRX ; Han Suk Bin,KRX ; Kim Jae Jeong,KRX, System and method for cleaning a semiconductor wafer.
  74. Bergman,Eric J.; Gebhart,Thomas Maximilian, System and methods for polishing a wafer.
  75. Bran, Mario E., System for megasonic processing of an article.
  76. Christenson,Kurt Karl; Lee,Nam Pyo; Michalko,Gary William; Rathman,Christina Ann, Transition flow treatment process and apparatus.
  77. Steven Verhaverbeke ; Christopher F. McConnell, Wet processing methods for the manufacture of electronic components.
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