초록 ▼

An apparatus for releasably engaging a semiconductor wafer (12) comprises a frame (18) adapted for engagement by a robotic arm (26). The frame mounts one end of an elongated arm (30) dimensioned for insertion into a pocket (14) in a wafer-carrying cassette (16). The arm has a first jaw (34) dependin

An apparatus for releasably engaging a semiconductor wafer (12) comprises a frame (18) adapted for engagement by a robotic arm (26). The frame mounts one end of an elongated arm (30) dimensioned for insertion into a pocket (14) in a wafer-carrying cassette (16). The arm has a first jaw (34) depending from its end distant from the frame for engaging a portion of the edge of the wafer. A second jaw (38) extends through a slot (46) in the arm so as to be opposite the first jaw for engaging a portion of the edge of the wafer diametrically opposed to that engaged by the first jaw. The second jaw is displaced to and from the first jaw by a pneumatic cylinder (48) to enable the wafer to be releasably captured between the jaws without any damage to the surfaces of the wafer.

대표청구항 ▼

Apparatus for releasably engaging a wafer, characterized by: a frame; an elongated arm mounted to said frame and extending outwardly therefrom, said arm having a longitudinally extending slot which extends therethrough; a first jaw depending from said arm at a point distant from said frame, said fir

Apparatus for releasably engaging a wafer, characterized by: a frame; an elongated arm mounted to said frame and extending outwardly therefrom, said arm having a longitudinally extending slot which extends therethrough; a first jaw depending from said arm at a point distant from said frame, said first jaw adapted to engage a portion of the edge of the wafer; a second jaw extending entirely through said slot so as to extend above said arm and having a jaw portion depending below said arm, said second jaw slidably mounted for movement in the slot with said depending jaw portion movable along the underside of said arm to and from the first jaw for engaging a portion of the edge of the wafer opposite to the portion engaged by said first jaw; and fluid cylinder means connected between said frame and said portion of said second jaw which extends above said arm for displacing said second depending jaw portion towards said first jaw to capture the wafer therebetween.