초록 ▼

A resin-molded semiconductor is produced by using an apparatus which comprises a mold having a plurailty of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, said cavit

A resin-molded semiconductor is produced by using an apparatus which comprises a mold having a plurailty of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at the end of each runner, said cavities being filled with a molding resin fed under pressure from said pots, with a part to be molded placed in each cavity. The process and apparatus of this invention prevent the molding defects resulting from the excessive flow resistance of resin and greatly improves the use efficiency of resin.

대표청구항 ▼

In a method for producing resin-encapsulated semiconductors the steps comprising; providing a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at an end of each runner

In a method for producing resin-encapsulated semiconductors the steps comprising; providing a mold having a plurality of pots from which a molding resin is fed under pressure, mutually independent runners extending from each pot, and a plurality of cavities serially disposed at an end of each runner, wherein a first cavity in each series located at the nearest position from a pot is connected to a runner through a gate, and each further cavity in each series is connected to each adjacent cavity in each series only through a slit formed as a flow channel in a lead frame interposed between a top part and a bottom part of said mold; discharging said resin from said pots into said runners such that said resin is fed only to said first cavity of each series through said gate; and discharging said resin from a cavity to an adjacent cavity only through said slit sequentially up to the last cavity in each series.