초록

A processing apparatus and method for performing a descum process (i.e. a process for removal of polymers and other organic residues) which uses a remote plasma, supplied through a distributor which includes a two-stage showerhead, to achieve improved results.

대표청구항 ▼

A method of treating a semiconductor wafer comprising: (a) transferring a wafer into a process vacuum chamber; (b) applying a pressure to said chamber less than ambient to maintain said chamber at less than ambient; (c) heating said wafer to an appropriate temperature; (d) providing an appropriate g

A method of treating a semiconductor wafer comprising: (a) transferring a wafer into a process vacuum chamber; (b) applying a pressure to said chamber less than ambient to maintain said chamber at less than ambient; (c) heating said wafer to an appropriate temperature; (d) providing an appropriate gas to a plasma generating module separated from said chamber and producing a remote plasma; (e) flowing said plasma sequentially through both stages of a two-stage showerhead, wherein each stage includes a baffle having a plurality of holes measuring 0.1-0.25 inch, and none of the holes in one stage is aligned with a hole of the other stage; and (f) flowing the gas over said wafer disposed within said chamber.