초록 ▼

Processes for forming metal patterns such as electric circuits and photosensitive materials useful therein are disclosed wherein a layer of photosensitive microcapsules is used to form a pattern of an adhesive, a metallic pigment, a metal salt or a reducing agent by exposing the layer of microcapsul

Processes for forming metal patterns such as electric circuits and photosensitive materials useful therein are disclosed wherein a layer of photosensitive microcapsules is used to form a pattern of an adhesive, a metallic pigment, a metal salt or a reducing agent by exposing the layer of microcapsules to actinic radiation and transferring the internal phase to a support member. A pattern of the pigment salt or reducing agent is thereby formed on the support member which is treated with an electroless plating solution to form the metal pattern.

대표청구항 ▼

A process for preparing a metal pattern which comprises pattern-wise exposing to actinic radiation a photosensitive material comprising a support having a layer of photosensitive microcapsules on the surface thereof, said microcapsules containing an internal phase including a seed material for formi

A process for preparing a metal pattern which comprises pattern-wise exposing to actinic radiation a photosensitive material comprising a support having a layer of photosensitive microcapsules on the surface thereof, said microcapsules containing an internal phase including a seed material for forming said metal pattern, said microcapsules additionally including in their internal phase a photohardenable or photosoftenable composition or having walls made of a photohardenable or photosoftenable composition, assembling said pattern-wise exposed photosensitive material with a support member upon which it is desired to form said metal pattern, subjecting said microcapsules to a uniform rupturing and/or transfer force such that said seed material is pattern wise transferred to the surface of said support member, and contacting said surface of said support member to which said seed material is pattern-wise transferred with a metal plating solution under such conditions that a metal is deposited on said support member in said pattern.