초록 ▼

A coolant activated contact-compact high intensity cooler (10) for cooling electronic modules and the like has an outer bellows portion (17) and a stack of alternating orifice/target plates (18) and spacer plates (19). Pressurize cooling fluid is caused to pass through orifices (26) in the plates (1

A coolant activated contact-compact high intensity cooler (10) for cooling electronic modules and the like has an outer bellows portion (17) and a stack of alternating orifice/target plates (18) and spacer plates (19). Pressurize cooling fluid is caused to pass through orifices (26) in the plates (18) and impinge upon the surface of another plate (18) downstream. The fluid also causes the bellows portion (17) to expand so as to be brought into contact with a heat source.

대표청구항 ▼

A compact high intensity cooler assembly adapted to be used as a heat sink for at least one heat generating component, comprising an expandable bellows connected to a bellows support and adapted to move into and out of contact with the at least one heat generating component; a plurality of spaced or

A compact high intensity cooler assembly adapted to be used as a heat sink for at least one heat generating component, comprising an expandable bellows connected to a bellows support and adapted to move into and out of contact with the at least one heat generating component; a plurality of spaced orifice plates operatively arranged in the interior of said bellows to provide low thermal resistance impingement cooling of the at least one heat generating component via a fluid coolant; and means for selectively supplying the fluid coolant under pressure to an interior of said bellows to move said bellows into contact with the at least one heat generating component and to effect impingement cooling via said plates, and thereafter exhausting the fluid coolant from the assembly.