초록 ▼

The instant invention relates to processes for producing tamper-evident overwrapped packages as well as the products which are produced. These processes utilize various energizing sources to create tamper-evident patterns between the package surface and the underside of the clear overwrap film closu

The instant invention relates to processes for producing tamper-evident overwrapped packages as well as the products which are produced. These processes utilize various energizing sources to create tamper-evident patterns between the package surface and the underside of the clear overwrap film closure. Tamper-evident patterns can also be created between heat-sealed overlapping sections of the overwrap film.

대표청구항 ▼

A tamper-evident fully sealed overwrap closure containing an underlying packaging structure comprising: (a) a continuous heat-sealed overwrap closure, (b) a package structure enclosed within the overwrap closure, (c) a tamper-evident pattern disposed between an underside of the overwrap closure and

A tamper-evident fully sealed overwrap closure containing an underlying packaging structure comprising: (a) a continuous heat-sealed overwrap closure, (b) a package structure enclosed within the overwrap closure, (c) a tamper-evident pattern disposed between an underside of the overwrap closure and an outer surface layer of the underlying package structure, wherein the tamper-evident pattern is a patterned coating on the underside of the overwrap closure, in non-bonding contact, and in register with a corresponding inverse patterned coating on the outer surface of the underlying package structure.