초록 ▼

A seal structure 58 between adjacent porous plates 18,20 and a method of making the seal structure for an electrochemical coil are disclosed. Various construction details are developed which facilitate fabrication and assembly. In one embodiment, the adjacent porous plates are electrolyte reservoir

A seal structure 58 between adjacent porous plates 18,20 and a method of making the seal structure for an electrochemical coil are disclosed. Various construction details are developed which facilitate fabrication and assembly. In one embodiment, the adjacent porous plates are electrolyte reservoir plates joined together at a three-layer seal structure to form an integral assembly.

대표청구항 ▼

A method for making an electrochemical cell assembly which includes a pair of adjacent gas porous plates having electrically and thermally conductive particles joined together leaving a void structure therebetween, the plates being joined together to form an integral structure that is electrically a

A method for making an electrochemical cell assembly which includes a pair of adjacent gas porous plates having electrically and thermally conductive particles joined together leaving a void structure therebetween, the plates being joined together to form an integral structure that is electrically and thermally conductive and which includes a region that blocks the flow of reactant gas and electrolyte, which includes the steps of: forming a first porous plate having electrically and thermally conductive particles which are joined together leaving a void structure therebetween, the first plate having a first surface which has a boundary defined by the particles; forming a second porous plate having electrically and thermally conductive particles which are joined together leaving a void structure therebetween, the second plate having a second surface which has a boundary defined by the particles, the second surface being spaced from the first surface leaving a region therebetween; disposing an intermediate layer between the plates such that the layer contacts the first surface of each plate, the intermediate layer consisting essentially of a binder and electrically and thermally conductive particles distributed throughout the binder, the intermediate layer having an initial concentration of particles in binder; integrally joining the intermediate layer and the porous plates at a temperature and a pressure which forces the binder through the boundaries of the adjacent plates into the void structure and around particles in the adjacent plates to form a first layer of particles in binder in the first plate, to form a second layer of particles in binder in the second plate, and to form from the particles disposed in the intermediate binder layer a third layer of particles in binder disposed between the plates, the third layer having a first surface adjacent to the first surface of the first porous plate and a second surface adjacent to the second surface of the second porous plate; cooling the plates and the third layer to a temperature which prevents separation of the porous plates and the intermediate layer while applying pressure to the assembly; wherein the concentration of particles in binder in the third layer after cooling is at least twice the initial concentration of particles in binder in the intermediate layer which exists prior to the step of integrally joining the intermediate layer and the porous plates.