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Efficient high temperature radiant furnace 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05B-003/64
출원번호 US-0193725 (1988-05-12)
발명자 / 주소
  • Blair David W. (Princeton NJ)
출원인 / 주소
  • Princeton Scientific Enterprises, Inc. (Princeton NJ 02)
인용정보 피인용 횟수 : 36  인용 특허 : 11

초록

A tubular radiant furnace having multiple radiation shields is capable of producing very high working temperatures in an extremely clean environment. A cool-walled quartz muffle tube surrounded by high temperature electrical heaters in a high temperature cavity defines the work chamber. Concentric r

대표청구항

A radiant furnace apparatus comprising: an inner tube which is substantially highly transmissive to radiant energy in the range from infrared to ultraviolet and which defines a working chamber for containing a workpiece; an outer tube which is also substantially highly transmissive to radiant energy

이 특허에 인용된 특허 (11)

  1. Campbell, Bryant A.; Miller, Nicholas E., Chemical vapor deposition apparatus.
  2. Pearce Charles W. (Emmaus PA) Schmidt Paul F. (Allentown PA), Diffusion furnace.
  3. Zeto Robert J. (Lincroft NJ) Zimmerman Franz X. (Erie PA), Dual chambered high pressure furnace.
  4. Erikson ; Carl A. ; Fielding ; John O. ; Cline ; Harvey E. ; Anthony ; T homas R., Furnace for practising temperature gradient zone melting.
  5. Moritoki Masato (Miki JPX) Fujikawa Takao (Kobe JPX) Kitagawa Kazuo (Kobe JPX) Miyanaga Junichi (Kobe JPX), Heater for hot isostatic pressing apparatus.
  6. Toole Monte M. (Mill Valley CA) Klein Raphael (Los Altos CA), High-pressure, high-temperature gaseous chemical apparatus.
  7. Arai Tetsuji (Tachikawa JPX) Mimura Yoshiki (Yokohama JPX), Light-radiant heating furnace.
  8. Goldsmith Forest S. (Newton MA) Waugh Arthur (Winchester MA), Movable core fast cool-down furnace.
  9. McNeilly ; Michael A. ; Benzing ; Walter C. ; Locke ; Jr. ; Richard M., Process for preparing semiconductor wafers with substantially no crystallographic slip.
  10. Stephens Thomas M. (Menlo Park CA) Takahashi Yoshihiro (San Francisco CA), Pyrolysis furnace.
  11. Anthony ; Thomas R. ; Cline ; Harvey E. ; Fielding ; John O. ; Erikson ; Carl A., Semiconductor body heater.

이 특허를 인용한 특허 (36)

  1. Gat Arnon ; Champetier Robert J. ; Fabian Ram Z.,ILX, Apparatus and method for filtering light in a thermal processing chamber.
  2. Hassan, Samer; Schwank, Bernd, Apparatus and method for measuring heat flux from radiant heater.
  3. Kristian E. Johnsgard ; Jean-Fran.cedilla.ois Daviet ; James A. Givens ; Stephen E. Savas ; Brad S. Mattson ; Ashur J. Atanos, Apparatus and method for thermal processing of semiconductor substrates.
  4. Wang, Jiaxiong, Assembled reactor for fabrications of thin film solar cell absorbers through roll-to-roll processes.
  5. Friedl,David; Friedman,Nitai; Buckley,Kenneth M., Cooking apparatus and method therefor.
  6. Friedl,David; Friedman,Nitai; Buckley,Kenneth M., Cooking apparatus and method therefor.
  7. Kordina Olle,SEX ; Hallin Christer,SEX ; Janzen Erik,SEX, Device and a method for epitaxially growing objects by CVD.
  8. Boehnke, Christian, Device for heating a meltable material.
  9. Anglin Noah L. ; Machamer Roy J. ; Hludzinski Stanley J. ; Garber Robert G., Efficient in-line fluid heater.
  10. Kordina, Olof Claes Erik; Berge, Rune, Epitaxial growth system for fast heating and cooling.
  11. Gat,Arnon, Fast heating and cooling apparatus for semiconductor wafers.
  12. Hsu, Chia-Ling, Film coating apparatus.
  13. Miyazaki, Hiroaki, Fluid heating device.
  14. Leidholm, Craig; Bollman, Brent, Formation of photovoltaic absorber layers on foil substrates.
  15. Seals, Roland D.; Parrott, Jeffrey G.; DeMint, Paul D.; Finney, Kevin R.; Blue, Charles T., Heat treatment furnace.
  16. Hathaway Kevin, Heating device containing a multi-lamp cone for heating semiconductor wafers.
  17. Gat Arnon, Heating device for semiconductor wafers.
  18. Vosen Steven R., Heating device for semiconductor wafers.
  19. Allan C. Morgan, High temperature rotating vacuum kiln and method for heat treating solid particulate material under a vacuum.
  20. Morgan Allan C., High temperature rotating vacuum kiln and method for heat treating solid particulate material under a vacuum.
  21. Morgan Allan C., High temperature rotating vacuum kiln for heat treating solid particulate material under a vacuum.
  22. Sheats, James R.; Dumanski, Werner, High-throughput assembly of series interconnected solar cells.
  23. Shooshtarian,Sohaila; Acharya,Narasimha; Elbert,Mike; Tillmann,Andreas; Zernickel,Dieter, Localized heating and cooling of substrates.
  24. Griffiths Stewart K. ; Nilson Robert H. ; Mattson Brad S. ; Savas Stephen E., Method and apparatus for thermal processing of semiconductor substrates.
  25. Gat, Arnon, Method for rapidly heating and cooling semiconductor wafers.
  26. Woll, Dirk, Oven enclosure for optical components with integrated purge gas pre-heater.
  27. Kellerman, Peter L.; Carlson, Frederick M., Pressure controlled heat source and method for using such for RTP.
  28. Ramamurthy, Sundar; Hegedus, Andreas G.; Thakur, Randhir, Processing multilayer semiconductors with multiple heat sources.
  29. Leighton, Roger G.; Leo, Michael F.; Kladias, Nicholas P.; Williams, James Edward, Radiant heater for print media.
  30. Moffat William A., Rapid heating and cooling vacuum oven.
  31. Savas Stephen E., System and method for rapid thermal processing.
  32. Savas Stephen E., System and method for rapid thermal processing with transitional heater.
  33. Johnsgard Kristian E. ; Mattson Brad S. ; McDiarmid James ; Zeitlin Vladimir J., System and method for thermal processing of a semiconductor substrate.
  34. Johnsgard Kristian E. ; Mattson Brad S. ; McDiarmid James ; Zeitlin Vladimir J., System and method for thermal processing of a semiconductor substrate.
  35. Kristian E. Johnsgard ; Brad S. Mattson ; James McDiarmid ; Vladimir J. Zeitlin, System and method for thermal processing of a semiconductor substrate.
  36. Kristian E. Johnsgard ; Brad S. Mattson ; James McDiarmid ; Vladimir J. Zeitlin, System and method for thermal processing of a semiconductor substrate.
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