초록 ▼

An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention

An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrome-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention\s semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package\s heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficients of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar, around 2 to 5 ppm/degree Kelvin (×10-6 m/m degrees Kelvin), in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

대표청구항 ▼

An electronic package comprising: a first circuitized substrate; a semiconductor device positioned above said first circuitized substrate and electronically coupled thereto; a second, circuitized substrate of flexible nature electrically connected to said first substrate and said semiconductor devic

An electronic package comprising: a first circuitized substrate; a semiconductor device positioned above said first circuitized substrate and electronically coupled thereto; a second, circuitized substrate of flexible nature electrically connected to said first substrate and said semiconductor device for providing said electrical coupling therebetween; a heat sink for providing heat escape from said package; and a heat spreader for providing an enhanced heat path from said semiconductor device to said heat sink, said heat spreader secured to said seminconductor device and said heat sink along first and second interfaces, respectively, using an adhesive, the coefficients of thermal expansion of said semiconductor device, said heat spreader, and said adhesive used to secure said heat spreader to said device along said first interface being within the range of from about 2.0 to about 5.0 ppm/degree Celsius (×10-6 m/m degrees Kelvin).