$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Method and apparatus for handling and processing wafer-like materials

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65G-065/00
출원번호 US-0222328 (1988-07-20)
발명자 / 주소
  • Eror Miroslav (Old Tappan NJ) Biehl Richard E. (Pearl River NY)
출원인 / 주소
  • Materials Research Corporation (Orangeburg NY 02)
인용정보 피인용 횟수 : 98  인용 특허 : 13

초록

An apparatus and method for moving a plurality of wafer-like articles such as semiconductor substrates back and forth between a carrier and a processing chamber maintained in an interior atmosphere isolated from that of the carrier. A translating arm pivotal about its center with a wafer engaging va

대표청구항

Apparatus for exchanging wafer-like articles between a position in a first plane and a processing location in a second plane perpendicular to said first plane with a minimum of motion of the apparatus and where at least part of the movement of each of the articles occurs simultaneously, said apparat

이 특허에 인용된 특허 (13)

  1. Uehara Akira (Yokohama JPX) Kiyota Hiroyuki (Hiratsuka JPX) Miyazaki Shigekazu (Sagamihara JPX) Nakane Hisashi (Kawasaki JPX), Apparatus for automatic semi-batch sheet treatment of semiconductor wafers by plasma reaction.
  2. Richards Edmond A. (Marlton NJ), Apparatus for conveying a semiconductor wafer.
  3. Takahashi Nobuyuki (Tokyo JPX) Sugimoto Ryuji (Tokyo JPX) Shirai Yasuyuki (Tokyo JPX), Automatic loader.
  4. Jacoby Hans-Dieter (Werdorf DEX) Schmidt Peter (Huettenberg DEX), Device for automatically transporting disk shaped objects.
  5. Nogami Mamoru (Uji JPX), End station for an ion implantation apparatus.
  6. Bouchaib Pierre (L\Etang la Ville FRX), Installation for treatment of materials for the production of semi-conductors.
  7. Bini Anselmo (1 ; Via Sabatini Chiesa Nuova di Monte San Pietro ITX 20050), Process and apparatus for the lifting and carriage of objects placed on tray-like supports.
  8. Takahashi Nobuyuki (Fuchu JPX), Processing apparatus comprising a cassette member temporarily swingable to vertically hold a plurality of substrates.
  9. Inaba Hajimu (Hino JPX) Nihei Ryo (Musashino JPX), Robot hand of an industrial robot.
  10. Hutchinson, Martin A.; Shaw, R. Howard; Coad, George, Transfer plate rotation system.
  11. Mirkovich Ninko T. (Novato CA) Zajac John (San Jose CA), Vacuum load lock apparatus.
  12. Dean Robert E. (High Bridge NJ) Dein Edward A. (Union NJ), Wafer handling apparatus and method.
  13. Burkhalter David W. (Redwood City CA) Kain Maurits R. (Redwood City CA), Wafer handling mechanism.

이 특허를 인용한 특허 (98)

  1. Lawson,John; Eckerson,Rodger; Landis,Michael, Adaptable processing element for a processing system and a method of making the same.
  2. Hendrickson Ruth Ann ; Van der Meulen Peter F., Apparatus and method for transporting substrates.
  3. Coomer, Stephen D.; McIntee, John Francis; Iha, Jozsef Michael; Borra, Robert T.; Lusby, Eric; Lombardi, Michael J., Apparatus and methods for manipulating semiconductor wafers.
  4. Coomer, Stephen D.; McIntee, John Francis; Iha, Jozsef Michael; Borra, Robert T.; Lusby, Eric; Lombardi, Michael J., Apparatus and methods for manipulating semiconductor wafers.
  5. Nova Michael P. ; Lillig John E. ; Karunaratne Kanchana Sanjaya Gunesekera ; Ewing William ; Satoda Yozo ; Potash Hanan, Automated sorting system for matrices with memory.
  6. Iwasaka,Hitoshi; Tokunaga,Hideyuki; Kobayashi,Koutaro, Bernoulli effect air nozzle for silicone wafer pickup tool.
  7. Boris Fishkin ; Seiji Sato ; Robert B. Lowrance, Controlled environment enclosure and mechanical interface.
  8. Fishkin Boris ; Sato Seiji ; Lowrance Robert B., Controlled environment enclosure and mechanical interface.
  9. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Conveying system for a vacuum processing apparatus.
  10. Ogliari, Vincenzo; Pozzetti, Vittorio; Preti, Franco, Device and method for handling substrates by means of a self-leveling vacuum system in epitaxial induction.
  11. Kempf Stefan,DEX ; Sichmann Eggo,DEX, Device for gripping, holdings and/or transporting substrates.
  12. Bluck, Terry; Latchford, Ian; Shah, Vinay; Riposan, Alex, Dual-mask arrangement for solar cell fabrication.
  13. Moura, Jairo T.; Hosek, Martin; Bottomley, Todd; Gilchrist, Ulysses, High speed substrate aligner apparatus.
  14. Moura, Jairo T.; Hosek, Martin; Bottomley, Todd; Gilchrist, Ulysses, High speed substrate aligner apparatus.
  15. Moura, Jairo Terra; Hosek, Martin; Bottomley, Todd; Gilchrist, Ulysses, High speed substrate aligner apparatus.
  16. Moura, Jairo Terra; Hosek, Martin; Bottomley, Todd; Gilchrist, Ulysses, High speed substrate aligner apparatus.
  17. Adibi, Babak; Prabhakar, Vinay; Bluck, Terry, Implant masking and alignment system with rollers.
  18. Tanaka, Masaru; Kuriyama, Masashi; Murooka, Hiroki, Impurity-doped layer formation apparatus and electrostatic chuck protection method.
  19. Ishikawa Seiji,JPX ; Mitsukura Takao,JPX, Loading and unloading unit for polishing apparatus.
  20. Nova Michael P. ; Lillig John E. ; Karunaratne Kanchana Sanjaya Gunesekera ; O'Neil Donald ; Ewing William ; Satoda Yozo, Matrices with memories in automated drug discovery and units therefor.
  21. LeBlanc ; III Arthur R. ; MacMillan Donald W. ; Parent Donald G. ; Parent Scott R. ; Rossignol Brian C., Metallizing machine.
  22. Kopacz, Stanislaw; Lawson, John, Method of securing a substrate in a semiconductor processing machine.
  23. Boitnott Charles A. ; Caughran James W. ; Egbert Steve, Modular process system.
  24. Gornicki Stella Zofia ; Krajnovich Douglas J., Multiple station vacuum deposition apparatus for texturing a substrate using a scanning beam.
  25. Keigler, Arthur; Goodman, Daniel L.; Guarnaccia, David G., Parallel single substrate marangoni module.
  26. Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L., Parallel single substrate processing system.
  27. Keigler, Arthur; Fisher, Freeman; Goodman, Daniel L.; Haynes, Jonathan, Parallel single substrate processing system.
  28. Keigler, Arthur, Parallel single substrate processing system with alignment features on a process section frame.
  29. Coomer, Stephen D.; Kopacz, Stanislaw; Reynolds, Glyn; Lombardi, Michael James; Visconti, Todd Michael, Reduced edge contact wafer handling system and method of retrofitting and using same.
  30. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample processing system.
  31. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample processing system.
  32. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample processing system.
  33. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  34. Kopacz, Stanislaw; Lawson, John, Semiconductor wafer holding assembly.
  35. Boitnott Charles A. ; Caughran James W. ; Egbert Steve, Semiconductor wafer processing carousel.
  36. Lawson, John; Irwin, Dale; Chervenak, Steve, Single piece pod shield for vertical plenum wafer processing machine.
  37. Lawson,John; Irwin,Dale; Chervenak,Steve; McIntee,John, Sputtering cathode adapter assembly and method.
  38. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in a vaccum tank.
  39. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Substrate changing-over mechanism in vacuum tank.
  40. Bluck, Terry; Shah, Vinay; Latchford, Ian; Riposan, Alexandru, System and method for bi-facial processing of substrates.
  41. Bluck, Terry; Shah, Vinay; Riposan, Alex, System architecture for vacuum processing.
  42. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Transferring device for a vacuum processing apparatus and operating method therefor.
  43. Caldwell, Doug; Garcia, Jr., Albert; Horback, Thomas J.; Lombardi, Michael James; McNicholas, Mark; Mize, Dean; Wang, Gon, Universal backplane assembly and methods.
  44. Ramsay, Bruce Gordon, Vacuum chamber load lock structure and article transport mechanism.
  45. Ramsay, Bruce Gordon, Vacuum chamber load lock structure and article transport mechanism.
  46. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  47. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method.
  48. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method using a vacuum chamber.
  49. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing and operating method with wafers, substrates and/or semiconductors.
  50. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  51. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus.
  52. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  53. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  54. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  55. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  56. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus.
  57. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  58. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  59. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  60. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  61. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  62. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  63. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  64. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus.
  65. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  66. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  67. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  68. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  69. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  70. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  71. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  72. Kato Shigekazu,JPX ; Nishihata Kouji,JPX ; Tsubone Tsunehiko,JPX ; Itou Atsushi,JPX, Vacuum processing apparatus and operating method therefor.
  73. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  74. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  75. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  76. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  77. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing apparatus and operating method therefor.
  78. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  79. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method therefor.
  80. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  81. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  82. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  83. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  84. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing apparatus and operating method therefor.
  85. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  86. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors.
  87. Derbinski Senia L. ; Parker Richard Fred, Vacuum processing apparatus with low particle generating wafer clamp.
  88. Kato, Shigekazu; Nishihata, Kouji; Tsubone, Tsunehiko; Itou, Atsushi, Vacuum processing equipment configuration.
  89. Shigekazu Kato JP; Kouji Nishihata JP; Tsunehiko Tsubone JP; Atsushi Itou JP, Vacuum processing equipment configuration.
  90. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsuenhiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  91. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  92. Kato,Shigekazu; Nishihata,Kouji; Tsubone,Tsunehiko; Itou,Atsushi, Vacuum processing operating method with wafers, substrates and/or semiconductors.
  93. Lombardi,Michael J.; Reynolds,Glyn J.; Foster,Robert F.; Rowan, Jr.,Robert C.; Turner,Frederick T., Vacuum-processing chamber-shield and multi-chamber pumping method.
  94. Smolanoff Jason ; Caldwell Doug ; Reynolds Glyn, Virtual shutter method and apparatus for preventing damage to gallium arsenide substrates during processing.
  95. Reiss Ira, Wafer holder and clamping ring therefor for use in a deposition chamber.
  96. Jelinek Vaclav, Wafer holding assembly and wafer processing apparatus having said assembly.
  97. Palm, Troy, Wafer inversion mechanism.
  98. Yabe, Kazunori, Work conveying system.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트