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An apparatus for the heat treatment of a substrate comprises a heat treating plate for heating or cooling a substrate, three holes for one substrate provided on the surface of the heat treating plate whose position is selected to suitably place the substrate, and three balls respectively in the thre

An apparatus for the heat treatment of a substrate comprises a heat treating plate for heating or cooling a substrate, three holes for one substrate provided on the surface of the heat treating plate whose position is selected to suitably place the substrate, and three balls respectively in the three holes with the diameter of the balls being slightly larger than the depth of the holes. The substrate is retained on the three balls for heat treatment.

대표청구항 ▼

An apparatus for the heat treatment of a substrate for heating or cooling the substrate, comprising: a heat treating plate having either heating or cooling means, a main surface and a plurality of through-holes arranged spaced apart from each other by a prescribed internal; three concave portions pr

An apparatus for the heat treatment of a substrate for heating or cooling the substrate, comprising: a heat treating plate having either heating or cooling means, a main surface and a plurality of through-holes arranged spaced apart from each other by a prescribed internal; three concave portions provided in spaced relationship with each other on a surface of said heat treating plate and each having the same depth, the positions of said three concave portions being selected so as to place said substrate a predetermined spacing above said main surface to facilitate heat exchange between said substrate and said main surface; three balls respectively and detachably retained in said three concave portions and having the same diameter which is larger than the depth of said concave portions for placing said substrate on the top portion thereof and thereby defining said predetermined spacing; and substrate elevating means capable of being protruded to said main surface of said heat treating plate and being retracted from said main surface through said through-holes with said means provided with a placing portion for placing said substrate on the upper portion thereof; said substrate elevating means comprising a plurality of pins which are raised and lowered through said plurality of through-holes and having their upper end portions maintained at the same height, with the upper end of said plurality of pins constituting said placing portions.