초록 ▼

A multilayer ceramic package is disclosed which includes a high frequency interconnect that simulates the performance of a conventional coaxial connector. The interconnect comprises a signal conductor surrounded by the ceramic material forming the package. A plurality of vias are formed through the

A multilayer ceramic package is disclosed which includes a high frequency interconnect that simulates the performance of a conventional coaxial connector. The interconnect comprises a signal conductor surrounded by the ceramic material forming the package. A plurality of vias are formed through the ceramic material so as to surround the conductor. These vias are then connected to a ground plane to form the outer shielding for the high frequency interconnect.

대표청구항 ▼

A ceramic package including a high frequency connector, said high frequency connector comprising a signal conductor including a first end and a second end for providing a signal path between a first device, respectively; ceramic material disposed to surround the signal conductor such that the first

A ceramic package including a high frequency connector, said high frequency connector comprising a signal conductor including a first end and a second end for providing a signal path between a first device, respectively; ceramic material disposed to surround the signal conductor such that the first and the second ends remain exposed; a plurality of vias formed through the ceramic material so as to enclose said signal conductor; and grounding means coupled to the plurality of vias to form, in combination with said plurality of vias, a ground plane insulator for said signal conductor.