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Composite electrical interconnection medium comprising a conductive network, and article, assembly, and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-009/09
출원번호 US-0079374 (1987-07-30)
발명자 / 주소
  • Jin Sungho (Millington NJ) Lambert William R. (Mendham NJ) Moore Robert C. (Lawrenceville NJ) Mottine
  • Jr. John J. (West Keansburg NJ) Sherwood Richard C. (New Providence NJ) Tiefel Thomas H. (Pisca
출원인 / 주소
  • American Telephone and Telegraph Company (New York NY 02)
인용정보 피인용 횟수 : 32  인용 특허 : 7

초록

An electrical interconnection medium is made as a composite of electrically conducting, magnetic particles in a nonconductive matrix material. Particles are magnetically aligned into a network which extends in at least two dimensions as, e.g., in a sheet or layer medium. A layer medium may further i

대표청구항

An electrical interconnection medium comprising a body of composite material in the form of a layer or sheet extending in x- and y-directions, said composite material comprising first particles in an essentially nonconductive matrix material, said first particles at least in part being magnetic and

이 특허에 인용된 특허 (7)

  1. Jin Sungho (Millington NJ) Mottine ; Jr. John J. (West Keansburg NJ) Seger ; Jr. Stephen G. (Summit NJ) Sherwood Richard C. (New Providence NJ) Tiefel Thomas H. (Piscataway NJ), Anisotropically conductive composite medium.
  2. McKaveney James P. (Claremont CA), Articles having an electrically conductive surface.
  3. Hartman, Richard B., Flexible tape having bridges of electrically conductive particles extending across its pressure-sensitive adhesive layer.
  4. King, Timothy W., Flexible tape having stripes of electrically conductive particles for making multiple connections.
  5. Smith Ray F. (Blue Springs MO) Mulik Edward J. (Kansas City MO), Magnetized hot melt adhesive and method of preparing same.
  6. Dery, Ronald A.; Jones, Warren C., Method of forming an electrical interconnection means.
  7. Ikeda Eiichi (Hatano JPX) Kayama Ikuo (Tama JPX) Izaki Masahiro (Kawasaki JPX), Pressure-sensitive conductive elastic sheet.

이 특허를 인용한 특허 (32)

  1. Palaniappa, Ilavarasan M.; Panavala, Vinayak Reddy; Fedde, Mickiel P., Adapter apparatus with deflectable element socket contacts.
  2. Palaniappa, Ilavarasan M., Adapter apparatus with socket contacts held in openings by holding structures.
  3. Palaniappa, Ilavarasan M.; Huang, Sue Min, Adapter apparatus with suspended conductive elastomer interconnect.
  4. Sunshine,Steven A.; Munoz,Beth C., Aligned particle based sensor elements.
  5. Sunshine,Steven A.; Munoz,Beth C., Aligned particle based sensor elements.
  6. Kashihara,Hideki; Yamamoto,Masamichi; Yorita,Jun; Toshioka,Hideaki; Osoegawa,Misako; Koyama,Keiji; Majima,Masatoshi; Tani,Yoshie, Anisotropic conductive film and method for producing the same.
  7. Jiang Tongbi ; Wu Zhiqiang ; Kao David ; Yang Rongsheng, Anisotropic conductive interconnect material for electronic devices, method of use and resulting product.
  8. Lewis, Nathan S.; Doleman, Brett J.; Briglin, Shawn; Severin, Erik J., Colloidal particles used in sensing arrays.
  9. Tarler, Matthew David, Composite material for a sensor for measuring shear forces.
  10. Lewis, Nathan S.; Lewis, Carol; Grubbs, Robert; Sotzing, Gregory Allen, Conductive organic sensors, arrays and methods of use.
  11. Simpson, Scott, Conductive polymer foams, method of manufacture, and articles thereof.
  12. Simpson, Scott; Kim, Ki-Soo; Hoffman, Jason, Conductive polymer foams, method of manufacture, and uses thereof.
  13. Soong, Sharon Y., Conductive polymer foams, method of manufacture, and uses thereof.
  14. Pillet,Michel, Contact device for improving lifetime of electrical connections.
  15. Pillet, Michel, Device for disconnecting an electrical supply line with a high-intensity current.
  16. Pillet, Michel, Electrical connection device having improved conductance.
  17. Weller, Dieter K.; Liu, Chao; Klemmer, Timothy J., Increased packing density in self-organized magnetic tray.
  18. Goldstein Avery N., Integrated circuit trenched features and method of producing same.
  19. Goldstein, Avery N., Integrated circuit trenched features and method of producing same.
  20. Goldstein, Avery N., Integrated circuit trenched features and method of producing same.
  21. Scott David M. (Wilmington DE), Interconnect structure having electrical conduction paths formable therein.
  22. Hasegawa Miki,JPX, Jumper connector.
  23. Alwan James J. ; Knappenberger Eric, Magnetically patterned etch mask.
  24. Freund, Michael S.; Lewis, Nathan S.; Briglin, Shawn M., Nanoparticle-based sensors for detecting analytes in fluids.
  25. Steinthal,Gregory; Sunshine,Steven; Burch,Tim; Plotkin,Neil; Hsiung,Chang Meng, Non-specific sensor array detectors.
  26. Ilavarasan Palaniappa, Offset array adapter.
  27. Palaniappa, Ilavarasan; Fedde, Mickiel, Packaged device adapter assembly.
  28. Ilavarasan Palaniappa ; Mickiel Fedde, Packaged device adapter assembly and mounting apparatus.
  29. Palaniappa, Ilavarasan; Fedde, Mickiel; Cramer, Jason Allen, Packaged device adapter assembly with alignment structure and methods regarding same.
  30. Yorita,Jun; Inazawa,Shinji; Majima,Masatoshi; Kashihara,Hideki; Sakamoto,Toshihiro; Toshioka,Hideaki, Plating and production methods for producing a fine metal component using a conductive paste.
  31. Pillet, Michel, Powder and paste for improving the conductivity of electrical connections.
  32. Tarler, Matthew David, Sensor for measuring shear forces.
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