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Painting truck washing system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/02
출원번호 US-0225371 (1988-07-28)
우선권정보 JP-0115284 (1987-07-28); JP-0211373 (1987-08-27)
발명자 / 주소
  • Kiba Hiroshi (Hiroshima JPX) Nagano Kenzou (Hiroshima JPX) Sumiyoshi Shigeru (Hiroshima JPX)
출원인 / 주소
  • Mazda Motor Corporation (Hiroshima JPX 03)
인용정보 피인용 횟수 : 40  인용 특허 : 4

초록

A painting truck washing system includes a painting truck, a washing robot with a spray nozzle, and a turntable unit disposed in a washing booth. The painting truck supported an automobile body during painting of the automobile body. The washing robot cooperates with a selector for selectively spray

대표청구항

A painting truck washing system, comprising: (a) a painting truck which supported an object to be painted during painting of the object; (b) fluid spraying means, disposed on one side of the painting truck, for spraying a high-pressure fluid to said painting truck from which the object is released,

이 특허에 인용된 특허 (4)

  1. Matsuoka Yasuo (Kawasaki JPX) Usuda Kinya (Yokohama JPX) Takano Michiro (Kawasaki JPX), Automatic developing apparatus.
  2. Vandas Edward B. (St. Louis MO), Conveyor lubricating and washing apparatus.
  3. Adam Michel (Gambsheim FRX), High pressure water washing device.
  4. Brigham ; deceased Roger S. (late of Crete IL) Brigham ; sole heir by Loraine M. (Harwood Heights IL), Machine for spray-coating can body exteriors.

이 특허를 인용한 특허 (40)

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  4. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  5. Fleisig, Jeffrey, Electrical power supplying device having a central power-hub assembly supplying electrical power to power plugs, adaptors and modules while concealed from view and managing excess power cord during power supplying operations.
  6. Fleisig, Jeffrey, Electrical power supplying device having a central power-receptacle assembly with a penisula-like housing structure supplying electrical power to power plugs, adaptors and modules while concealed from view during power supplying operations.
  7. Fleisig, Jeffrey, Electrical power supplying system having an electrical power supplying docking station with a multi-function module for use in diverse environments.
  8. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  9. Jones, William D., High pressure fourier transform infrared cell.
  10. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  11. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  12. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  13. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  14. Shullman, Michael; Mayhew, Thomas, Mechanized anthropomorphic car wash apparatus.
  15. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  16. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  17. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  18. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  19. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  20. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  21. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  22. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  23. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  24. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  25. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  26. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  27. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  28. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  29. Wuester,Christopher D., Process flow thermocouple.
  30. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
  31. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.
  32. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  33. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  34. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
  35. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
  36. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.
  37. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  38. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  39. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  40. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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