$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Circuit module with direct liquid cooling by a coolant flowing between a heat producing component and the face of a pist

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0366945 (1989-06-15)
발명자 / 주소
  • Chrysler Gregory (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 45  인용 특허 : 6

초록

In an improved circuit module with a flat chip-carrying substrate and cylindrical pistons that contact the chips for cooling, each piston has an axial bore that carries a dielectric liquid to the chip and the lower face of the piston (facing the chip) is spaced away from the chip to establish radial

대표청구항

A circuit module, comprising: a substrate having a chip carrying surface; an array of chips located at chip sites on the chip carrying surface of the substrate; a hat cooperating with the substrate to form an enclosed space for the chips, the hat comprising supply means for supplying a liquid coolan

이 특허에 인용된 특허 (6)

  1. Eastman, Dean E.; Eldridge, Jerome M.; Petersen, Kurt E.; Olive, Graham, Cooling system for VLSI circuit chips.
  2. Yamamoto Haruhiko (Yokohama JPX) Sakai Masaaki (Tokyo JPX) Udagawa Yoshiaki (Tokyo JPX) Katsuyama Kouji (Yokohama JPX) Nakata Mitsuhiko (Kawasaki JPX), Cooling system for electronic circuit device.
  3. Chu Richard C. (Poughkeepsie NY) Gupta Omkarnath R. (Poughkeepsie NY) Hwang Un-Pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Gas encapsulated cooling module.
  4. Chrysler Gregory M. (Poughkeepsie NY) Chu Richard Chao-Fan (Poughkeepsie NY) Simmons Robert E. (Poughkeepsie NY), Immersion cooled circuit module with improved fins.
  5. Saaski Elric (Kirkland WA) Hannemann Robert J. (Wellesley MA) Fox Leslie R. (Acton MA), Integral heat pipe module.
  6. Ostergren Carl D. (Montgomery NY) Paivanas ; deceased John A. (late of Williamsville NY by Sophia Paivanas ; executor), Thermal conduction disc-chip cooling enhancement means.

이 특허를 인용한 특허 (45)

  1. Byrd Charles M. ; Pfister Dennis M. ; Warriner Ted W., Absorbent pair refrigerant system.
  2. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem.
  3. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow.
  4. Reyzin,Ilya; Bhatti,Mohinder Singh; Scherer,Lawrence P.; Hayes,Andrew R.; Joshi,Shrikant Mukund, Apparatus for controlling thermal interface between cold plate and integrated circuit chip.
  5. Meyer,Michael T., Apparatus for heat transfer and critical heat flux enhancement.
  6. Pfister Dennis M. ; Byrd Charles M., Circuit board having an integral sorber.
  7. Pfister Dennis M. ; Byrd Charles M., Coaxial waveguide applicator for an electromagnetic wave-activated sorption system.
  8. Karidis,John P.; Schultz,Mark; Webb,Bucknell C., Compliant thermal interface structure with vapor chamber.
  9. Leigh, Kevin B; Megason, George D, Component cooling.
  10. Pfister Dennis M. ; Byrd Charles M., Controlled production of ammonia and other gases.
  11. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  12. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
  13. Pfister Dennis M. ; Byrd Charles M., Cooling apparatus having integrated sorber-evaporator structure.
  14. von Gutfeld, Robert J.; Hamann, Hendrik; Prikas, Michael T., Cooling of surface temperature of a device.
  15. Pfister Dennis M. ; Byrd Charles M., Electromagnetic wave-activated sorption refrigeration system.
  16. Pfister Dennis M. ; Byrd Charles M., Electronic device cooling apparatus.
  17. Bakhru, Nanik; Grill, Alfred; Hopper, Gregory S.; Marotta, Egidio; Meyerson, Bernard S.; Patel, Vishnubhai V., Erosion/corrosion resistant diaphragm.
  18. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  19. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack.
  20. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems.
  21. Cote, Normand; Demko, Peter J.; Gardell, David L.; Gelorme, Jeffrey D.; Knox, Marc D.; Lawson, George J.; Rivera, Kathryn C., Liquid recovery, collection method and apparatus in a non-recirculating test and burn-in application.
  22. Attlesey, Chad D., Liquid submersion cooled data storage or memory system.
  23. Attlesey, Chad D., Liquid submersion cooled electronic system.
  24. Attlesey, Chad D., Liquid submersion cooled power supply system.
  25. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems.
  26. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit.
  27. Pfister Dennis M. ; Byrd Charles M., Method and apparatus for cooling electrical components.
  28. Pfister Dennis M. ; Byrd Charles M., Method and apparatus for cooling electrical components.
  29. Pfister Dennis M. ; Byrd Charles M., Method and apparatus for cooling electrical components.
  30. Davidson,Howard, Method and apparatus for making a sorber.
  31. Dennis M. Pfister ; Charles M. Byrd, Method and system for cooling electrical components.
  32. Natsuo Arai JP; Kaoru Katayama JP; Eiichi Kiryuu JP, Method for sealing liquid coolant into module.
  33. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Open flow cold plate for immersion-cooled electronic packages.
  34. Belady, Christian L.; Peterson, Eric C., Pin retention for thermal transfer interfaces, and associated methods.
  35. Shinohara, Toshiaki; Yoshida, Takanobu, Power semiconductor device with high radiating efficiency.
  36. Attlesey, Chad D., Rack mounted liquid submersion cooled electronic system.
  37. Kubo, Hideo; Kawashima, Hisashi; Wei, Jie; Ishimine, Junichi; Suzuki, Masahiro; Udagawa, Yoshiaki; Mochizuki, Masahiro, Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator.
  38. Kubo,Hideo; Kawashima,Hisashi; Wei,Jie; Ishimine,Junichi; Suzuki,Masahiro; Udagawa,Yoshiaki; Mochizuki,Masahiro, Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator.
  39. Dennis M. Pfister ; Charles M. Byrd, Sorber having a cooling mechanism.
  40. Pfister Dennis M. ; Byrd Charles M., Sorber having a cooling mechanism.
  41. Dennis M. Pfister ; Charles M. Byrd, Sorber having flexible housing.
  42. Pfister Dennis M. ; Byrd Charles M., Sorber having flexible housing.
  43. Pfister Dennis M. ; Byrd Charles M., Sorber having flexible housing.
  44. Pfister Dennis M. ; Byrd Charles M., Sorption refrigeration appliance.
  45. Pfister Dennis M. ; Byrd Charles M., Sorption refrigeration appliance.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트