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Heat pipe cooled electronic circuit card 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0297526 (1989-01-17)
발명자 / 주소
  • Cirrito Vincent (Massapequa Park NY) Koubek Kevin J. (South Setauket NY) Quadrini John A. (Northport NY)
출원인 / 주소
  • Grumman Aerospace Corporation (Bethpage NY 02)
인용정보 피인용 횟수 : 37  인용 특허 : 7

초록

Two metal plates have U-shaped grooves formed therein so that the plates may form congruent halves wherein matching grooves complete independent heat pipes. The bight section of each heat pipe serves as an evaporator section while the parallel arms of each heat pipe form condenser sections. A wick i

대표청구항

An electronic component module comprising: a first metal card having a plurality of parallel spaced and generally U-shaped grooves formed within a first interior surface thereof; a second metal card having a plurality of parallel spaced and generally U-shaped grooves formed within a first interior s

이 특허에 인용된 특허 (7)

  1. Edelstein Fred (Hauppauge NY) Haslett Robert A. (Dix Hills NY) Kosson Robert L. (Massapequa NY) Harwell William (Coram NY), Capillary-pumped heat transfer panel and system.
  2. Murphy John E. (Los Angeles CA) Gardner William T. (Los Angeles CA), Electronic module with self-activated heat pipe.
  3. Marcus Bruce D. (Los Angeles CA) Fleischman George L. (Inglewood CA), Flat-plate heat pipe.
  4. Basiulis Algerd (Redondo Beach CA), Heat pipe cooling module for high power circuit boards.
  5. Haslett Robert A. (Dix Hills NY), Heat pipe panel and method of fabrication.
  6. Nelson ; Lloyd A. ; Sekhon ; Kalwant S., Heat pipe thermal mounting plate for cooling electronic circuit cards.
  7. Lijoi Bruno (Farmingdale NY) Cirrito Vincent (Massapequa Park NY) Edelstein Fred (Hauppauge NY), Heat-pipe cooled electronic circuit card.

이 특허를 인용한 특허 (37)

  1. Broder Damon ; Hood ; III Charles D., Apparatus for cooling a heat generating component in a computer.
  2. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.
  3. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device.
  4. Rosenfeld,John H.; Minnerly,Kenneth G., Brazed wick for a heat transfer device and method of making same.
  5. Tonosaki,Minehiro; Kato,Eisaku; Sano,Naoki; Kitagawa,Koji, Cooling device, electronic equipment device, and method of manufacturing cooling device.
  6. Lu, Minhua; Mok, Lawrence S., Cooling of substrate using interposer channels.
  7. Lu, Minhua; Mok, Lawrence S., Cooling of substrate using interposer channels.
  8. Lu, Minhua; Mok, Lawrence S., Cooling of substrate using interposer channels.
  9. Roessler Robert Joseph ; Woods ; Jr. William Lonzo, Electrical circuit board heat dissipation system.
  10. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  11. Stefanoski, Zoran, Embedded heat pipe in a hybrid cooling system.
  12. Phillips,Alfred L.; Khrustalev,Dmitry K.; Wert,Kevin L.; Wilson,Michael J.; Wattelet,Jonathan P.; Broadbent,John, Flexible loop thermosyphon.
  13. Phillips,Alfred L.; Khrustalev,Dmitry K.; Wert,Kevin L.; Wilson,Michael J.; Wattelet,Jonathan P.; Broadbent,John, Flexible loop thermosyphon.
  14. Xia,Wan Lin; Li,Tao; Xiao,Min Qi; Zhang,Jun; Qin,Ji Yun, Heat dissipation device.
  15. Lai, Cheng-Tien; Lee, Tsung-Lung; Wang, Shenghua, Heat dissipation device with working liquid received in circulatory route.
  16. Xie Hong, Heat pipe lid for electronic packages.
  17. Ueda, Akira; Suzuki, Masumi, Heat pipe type cooler.
  18. Ueda,Akira; Suzuki,Masumi, Heat pipe type cooler.
  19. Rosenfeld,John H.; Ernst,Donald M., Heat transfer device and method of making same.
  20. Dussinger, Peter M.; Myers, Thomas L.; Rosenfeld, John H.; Minnerly, Kenneth L., Integrated circuit heat pipe heat spreader with through mounting holes.
  21. L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
  22. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  23. Ketonen Veli-Pekka ; Laureanti Steven J., Method and system for efficiently removing heat generated from an electronic device.
  24. Lu, Minhua; Mok, Lawrence S., Method of forming a substrate with interposer channels for cooling the substrate.
  25. Hardesty, Robert E., Micro-channel pulsating heat pipe.
  26. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Sintered grooved wick with particle web.
  27. Garner,Scott D.; Lindemuth,James E.; Toth,Jerome E.; Rosenfeld,John H.; Minnerly,Kenneth G., Sintered grooved wick with particle web.
  28. Stefanoski, Zoran; Kim, Jeong H., System for efficiently cooling a processor.
  29. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  30. Phillips, Alfred L.; Khrustalev, Dmitry K.; Wert, Kevin L.; Wilson, Michael J.; Wattelet, Jonathan P.; Broadbent, John, Thermal bus for electronics systems.
  31. Garner, Scott D., Thermal management system and method for electronics system.
  32. Garner, Scott D., Thermal management system and method for electronics system.
  33. Garner,Scott D., Thermal management system and method for electronics system.
  34. Wilson, James S., Thermal management system and method for thin membrane type antennas.
  35. Garner, Scott D.; Lindemuth, James E.; Toth, Jerome E.; Rosenfeld, John H.; Minnerly, Kenneth G., Tower heat sink with sintered grooved wick.
  36. Lindemuth, James E.; Rosenfeld, John H., Vapor chamber with sintered grooved wick.
  37. Lindemuth,James E.; Rosenfeld,John H., Vapor chamber with sintered grooved wick.
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