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A method of making a cutting edge, which comprises coating a substrate cutting edge having a defined cross-sectional geometry, with a material which is harder than the material of the substrate cutting edge by a vapor deposition or sputtering process, if necessary in the presence of gaseous or vapor

A method of making a cutting edge, which comprises coating a substrate cutting edge having a defined cross-sectional geometry, with a material which is harder than the material of the substrate cutting edge by a vapor deposition or sputtering process, if necessary in the presence of gaseous or vaporized molecules of another element or a compound of another element where it is desired to form the coating of a compound, at a pressure of less than 10-2 m bar, while simultaneously subjecting the cutting edge to ion bombardment with ions of sufficient mass and energy to cause sputter removal of the deposited material at a rate which is less than the rate of deposition, whereby a cutting edge formed of the deposited material and having a defined cross-sectional geometry and ultimate tip radius, is obtained.

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A method for making a cutting edge which comprises the steps of: a. selecting a cutting edge substrate having a cross-sectional shape up to a distance of forty micrometers from the extreme edge which is defined by the equation: w≤adn where w is the tip width in m0 and up to about 1, and n is an expo

A method for making a cutting edge which comprises the steps of: a. selecting a cutting edge substrate having a cross-sectional shape up to a distance of forty micrometers from the extreme edge which is defined by the equation: w≤adn where w is the tip width in m0 and up to about 1, and n is an exponent having a value in the range of 0.65 to 0.75. b. coating the selected cutting edge substrate with a material which is harder than the material of the substrate coating edge by a vapor deposition or sputtering process at a pressure of less than about 10-3 m bar, said coating step optionally including the presence of gaseous or vaporized molecules of another element or compound of another element, and c. simultaneously subjecting the selected cutting edge substrate to ion bombardment with ions of sufficient mass and energy to cause sputter removal of the deposited material at a rate which is less than the rate of deposition to provide a cutting edge formed of the deposited material and having a cross-sectional geometry defined by the equations: [Figure] and w3≥(w-2f)a2d2n where w, d, a and n have the above-stated meanings, m is the ratio of the yield strength of the deposited coated material to that of the substrate material, and f is between about 0.2 m0.3 m500 Å, and where the aspect ratio of the coating is between about 4.5 to about 6.8.