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Resin encapsulated electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/28
  • H01L-023/30
출원번호 US-0150502 (1988-02-01)
우선권정보 JP-0130682 (1980-09-22)
발명자 / 주소
  • Segawa Tadanori (Hitachi JPX) Suzuki Hiroshi (Hitachi JPX) Kitamura Masahiro (Hitachi JPX) Numata Shunichi (Hitachi JPX) Nishi Kunihiko (Higashikurume JPX)
출원인 / 주소
  • Hitachi, Ltd. (Tokyo JPX 03)
인용정보 피인용 횟수 : 33  인용 특허 : 8

초록 ▼

Resin encapsulated electronic devices are provided by encapsulating so-called flat-shaped, plate-like, or angular-shaped electronic devices with a resin composition containing rubber-like particles preferably having an average particle size of 150 m

대표청구항 ▼

A semiconductor device encapsulated by a cured resin composition; said cured resin composition comprising a matrix resin and rubber particles uniformly dispersed therein and being the encapsulating material for said semiconductor device; the rubber particles having rubber elasticity and being formed

이 특허에 인용된 특허 (8)

  1. Voyles Gerald A. (Indianapolis IN) Davies William D. (Greencastle IN), Compressible intermediate layer for encapsulated electrical devices.
    상세보기
  2. Schoberl Werner (Massenbachhausen DT), Encapsulated light-emitting diode structure and array thereof.
    상세보기
  3. Kaplan Neil (Great Neck NY), Encapsulating moisture-proof coating.
    상세보기
  4. Nishikawa Hiroshi (Machida JPX) Saruta Ueki (Machida JPX) Asai Shin-ichiro (Machida JPX), Epoxy resin composition for encapsulating semiconductor.
    상세보기
  5. Imai ; Takeshi, Resin-sealed electrical device.
    상세보기
  6. Imai Takeshi (Oobu JA) Niwa Tsutomu (Kariya JA) Motani Kenji (Kagoshima JA), Resin-sealed electrical device.
    상세보기
  7. Hartmann Gunter (Munich DT) Schwarz Joachim-Ullrich (Munich DT) Keil Klaus (Munich DT), Simplified housing structure including a heat sink for a semiconductor unit.
    상세보기
  8. Sommer Karlheinz (Warstein DEX) Khler Werner (Warstein DEX), Surface passivated semiconductor device and method for producing the same.
    상세보기

이 특허를 인용한 특허 (33)

  1. Arifuku, Motohiro; Watanabe, Itsuo; Motomura, Kouji; Kobayashi, Kouji; Gotoh, Yasushi; Fujinawa, Tohru, Adhesive agent, method of connecting wiring terminals and wiring structure.
    상세보기
  2. Arifuku, Motohiro; Watanabe, Itsuo; Motomura, Kouji; Kobayashi, Kouji; Gotoh, Yasushi; Fujinawa, Tohru, Adhesive, method of connecting wiring terminals and wiring structure.
    상세보기
  3. Arifuku,Motohiro; Watanabe,Itsuo; Motomura,Kouji; Kobayashi,Kouji; Gotoh,Yasushi; Fujinawa,Tohru, Adhesive, method of connecting wiring terminals and wiring structure.
    상세보기
  4. Silverbrook, Kia; Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai, Assembly of electronic components.
    상세보기
  5. Pernyeszi Joseph (Scotts Valley CA) Walters Michael D. (San Jose CA) Venor Kevin (Ft. Collins CO), Composite optical shielding.
    상세보기
  6. Furukawa, Koji, Connector.
    상세보기
  7. MacPherson John, Die structure using microspheres as a stress buffer for integrated circuit prototypes.
    상세보기
  8. Doi,Hiroaki; Urushiwara,Noriyoshi; Matsushita,Akira, Electronic circuit device with reduced breaking and cracking.
    상세보기
  9. Williams, Susan; Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai, Electronic component with wire bonds in low modulus fill encapsulant.
    상세보기
  10. Froebel Francis E. (Essex Junction VT) Gardell David L. (Fairfax VT) Irish Gary H. (Jericho VT) Shaikh Mohammed S. (Essex Junction VT), Encapsulated semiconductor chip module and method of forming the same.
    상세보기
  11. Kondo, Takashi; Kono, Hiroki; Ebe, Yuki, Encapsulating sheet and optical semiconductor element device.
    상세보기
  12. Kondo, Takashi; Kono, Hiroki; Ebe, Yuki, Encapsulating sheet and optical semiconductor element device.
    상세보기
  13. Bator, Philip M.; Macko, Andrew R.; King, Jr., Jack H., Method for absorbing active, external and dynamic magnetic fields using a ferrite encapsulated coating.
    상세보기
  14. Singh, Harvinder, Method for making a circuit assembly having an integral frame.
    상세보기
  15. Reese, Hans-Juergen; Schmidt, Hans Ulrich; Leitner, Johann, Method for producing a composite material from stones and a plastic material.
    상세보기
  16. Eisenhardt, Andrea; Leberfinger, Marcus; Roser, Joachim, Method for stabilising and securing rivers, slopes and embankments.
    상세보기
  17. Masakazu Nakabayashi JP, Method of producing semiconductor devices.
    상세보기
  18. Matsuo Takahiro,JPX ; Maruyama Yoshio,JPX ; Hikita Osamu,JPX ; Kadoriku Shinji,JPX, Module for packaged IC.
    상세보기
  19. Toshiaki Tanaka JP; Takafumi Dohdoh JP; Tsutomu Kitakatsu JP; Aizou Kaneda JP; Masaaki Yasuda JP; Takashi Kousaka JP; Akira Kageyama JP, Paste composition, and protective film and semiconductor device both obtained with the same.
    상세보기
  20. Tanaka, Jun; Isoda, Keiko; Ogata, Kiyoshi, Resin-encapsulated semiconductor apparatus and process for its fabrication.
    상세보기
  21. Shizuno, Yoshinori, Semiconductor acceleration sensor device and method for manufacturing the same.
    상세보기
  22. Shizuno, Yoshinori, Semiconductor acceleration sensor device and method for manufacturing the same.
    상세보기
  23. Adachi Masaki,JPX ; Yamamura Megumi,JPX, Semiconductor device.
    상세보기
  24. Satoshi Yamada JP; Michitaka Kimura JP; Masatoshi Yasunaga JP, Semiconductor device and manufacturing method thereof.
    상세보기
  25. Carmona, Manuel; Legen, Anton; Wennemuth, Ingo, Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same.
    상세보기
  26. Yamakawa, Kimio; Isshiki, Minoru; Otani, Yoshiko; Mine, Katsutoshi, Semiconductor device having an adhesive and a sealant.
    상세보기
  27. Marshall Paul N. ; Tseka Thomas C. ; Walsh Brendan M. ; Fritz James E., Shock-resistant electronic circuit assembly.
    상세보기
  28. Marshall Paul N. ; Tseka Thomas C. ; Walsh Brendan M. ; Fritz James E., Shock-resistant electronic circuit assembly.
    상세보기
  29. MacPherson John, Using microspheres as a stress buffer for integrated circuit prototypes.
    상세보기
  30. Nakabayashi Masakazu,JPX, Wafer sheet with adhesive on both sides and attached semiconductor wafer.
    상세보기
  31. Chung-Long-Shan, Laval; Tankongchumruskul, Kiangkai; Silverbrook, Kia, Wire bond encapsulant control method.
    상세보기
  32. Arifuku, Motohiro; Watanabe, Itsuo; Motomura, Kouji; Kobayashi, Kouji; Gotoh, Yasushi; Fujinawa, Tohru, Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles.
    상세보기
  33. Arifuku, Motohiro; Watanabe, Itsuo; Motomura, Kouji; Kobayashi, Kouji; Gotoh, Yasushi; Fujinawa, Tohru, Wiring terminal-connecting adhesive.
    상세보기

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