$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Localized cooling apparatus for cooling integrated circuit devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-025/04
출원번호 US-0368741 (1989-06-20)
발명자 / 주소
  • Schmidt William L. (Acton MA) Olson Richard E. (Rindge NH) Solley Dennis J. (Windham NH)
출원인 / 주소
  • Digital Equipment Corporation (Maynard MA 02)
인용정보 피인용 횟수 : 66  인용 특허 : 13

초록 ▼

A localized cooling apparatus is provided for individually cooling integrated circuit chips mounted on a circuit board for insertion into a computer backplane. The cooling apparatus consists of a circuit board occupying a first slot and having an integrated circuit chip mounted thereon, the performa

대표청구항 ▼

Localized cooling apparatus for cooling an integrated circuit chip mounted on a circuit board configured for connection to a first connector of a backplane having a plurality of connectors, said apparatus comprising: heat removal assembly means for connection to a second connector of said plurality

이 특허에 인용된 특허 (13)

  1. Swiatosz Edmund (Maitland FL), Charge coupled device temperature gradient and moisture regulator.
    상세보기
  2. Tobey Richard (648 Sheraton Dr. Sunnyvale CA 94087), Computer element performance enhancer.
    상세보기
  3. Bendell Sidney L. (Sequin WA) Michaelis Theodore D. (Medford Township ; Burlington County NJ), Cooler control for a solid-state imager camera.
    상세보기
  4. Swiatosz Edmund (Maitland FL), Integrated circuit temperature gradient and moisture regulator.
    상세보기
  5. Fontan Jacques (Sonchamp FRX) Kurzweil Karel (Saint Nom La Breteche FRX) Dehaine Grard (Chatillon FRX), Method of and apparatus for mounting an IC chip.
    상세보기
  6. Hunsperger Robert G. (Newark DE), Monolithic Peltier temperature controlled junction.
    상세보기
  7. Richman Jay L. (Montville NJ), Peltier junction used for thermal control of solid state devices.
    상세보기
  8. Yoshikawa Shoji (Tokyo JPX), Temperature control device for a semiconductor laser.
    상세보기
  9. Watanabe Hideo (Kanagawa JPX), Temperature controller for semiconductor device.
    상세보기
  10. Watanabe Hideo (Kaisei JPX), Temperature controller for semiconductor devices.
    상세보기
  11. Ostergren Carl D. (Montgomery NY) Paivanas ; deceased John A. (late of Williamsville NY by Sophia Paivanas ; executor), Thermal conduction disc-chip cooling enhancement means.
    상세보기
  12. Perchak Robert M. (Dayton OH), Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing.
    상세보기
  13. Chow William W. (Tucson AZ) Fields ; Jr. Davis S. (Pima County AZ) Hu Paul Y. (Pima County AZ) Lopez Jorge L. (Pima County AZ), Thermoelectric cooling of magnetic head assemblies.
    상세보기

이 특허를 인용한 특허 (66)

  1. Meir,Ronen, Active cooling system for CPU.
    상세보기
  2. Novotny, Shlomo; Dunn, John; Vogel, Marlin, Active temperature gradient reducer.
    상세보기
  3. Limper-Brenner Linda ; Schmidt Detlef W. ; McDunn Kevin J. ; Press Minoo D., Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic comp.
    상세보기
  4. McDunn Kevin J. (Lake in the Hills IL) Limper-Brenner Linda (Glenview IL) Press Minoo D. (Schaumburg IL), Apparatus and method for shielding an electronic module from electromagnetic radiation.
    상세보기
  5. Ballard Gerald W. (West Dundee IL) Turocy James W. (Arlington Heights IL) Beise Thomas R. (Hoffman Estates IL), Apparatus and method for spray-cooling an electronic module.
    상세보기
  6. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus and method for spray-cooling an electronic module.
    상세보기
  7. Janicek George M. ; Liu Rui ; Scocca Anthony J., Apparatus and method of adapting a rectifier module to enhance cooling.
    상세보기
  8. Nobutaka Nishigaki JP, Apparatus for controlling internal heat generating circuit.
    상세보기
  9. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus for spray-cooling multiple electronic modules.
    상세보기
  10. Conroy Chad M. ; Greenwood Mark W., Burn-in board and heat sink assembly mounting rack.
    상세보기
  11. Rochel Sohail ; Norvell Gene Edgar, Car amplifier incorporating a peltier device for cooling.
    상세보기
  12. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
    상세보기
  13. Hershberger, Jeffrey Gerard; Hill, Richard F.; Smythe, Robert Michael; Sutsko, Michael G., Circuit assemblies including thermoelectric modules.
    상세보기
  14. Baquiano, Carmelo Engracia; Cayaban, Carmelo Delovino; Montalbo, Paul Francis Brosas; Celocia, Joseph Estorgio, Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature.
    상세보기
  15. Ahn,Kie Y.; Forbes,Leonard; Cloud,Eugene H., Compact system module with built-in thermoelectric cooling.
    상세보기
  16. Adelbert M. Gillen, Compact thermoelectric cooling system.
    상세보기
  17. Adelbert M. Gillen, Compact thermoelectric cooling system.
    상세보기
  18. Sauciuc,Ioan; Chrysler,Gregory M.; Mahajan,Ravi V., Computer system having controlled cooling.
    상세보기
  19. Turner William Evans ; Seppa Ronald ; Turner William Edward, Cooled electrical system for use downhole.
    상세보기
  20. Turner William Evans ; Seppa Ronald ; Turner William Edward ; Sallwasser Alan J., Cooled electrical system for use downhole.
    상세보기
  21. Hamilton, Harold E.; Conroy, Chad M., Cooling air flow control valve for burn-in system.
    상세보기
  22. Hamilton,Harold E.; Conroy,Chad M., Cooling air flow control valve for burn-in system.
    상세보기
  23. DeVilbiss Roger S. (Dallas TX) Quisenberry Tony M. (Highland Village TX) Powell Harry C. (Shipman VA), Current control circuit for improved power application and control of thermoelectric devices.
    상세보기
  24. Stoermer, Peter, Electrical connection arrangement.
    상세보기
  25. Joshi Rajiv Vasant ; Reohr William Robert, Embedded thermal conductors for semiconductor chips.
    상세보기
  26. Joshi Rajiv Vasant ; Reohr William Robert, Embedded thermal conductors for semiconductor chips.
    상세보기
  27. Pozzuoli,Marzio Paride; Xie,Xiaoyu, Environmentally hardened ethernet switch.
    상세보기
  28. Pippin,Jack D., Fail-safe thermal sensor apparatus and method.
    상세보기
  29. Dautartas, Mindaugas F.; Freund, Joseph M.; Przybylek, George J., Flexible semiconductor device support with integrated thermoelectric cooler and method for making same.
    상세보기
  30. Han, Tai-Sheng, Heat dissipation device for display card.
    상세보기
  31. Hanin,Leonid; Campo,Antonio, Heat exchange device.
    상세보기
  32. Ross, Peter George, Heat spreading chassis for rack-mounted computer system.
    상세보기
  33. Nishigaki,Nobutaka; Ninomiya,Ryoji; Sakai,Makoto, Method and apparatus for controlling internal heat generating circuit.
    상세보기
  34. Subramaniyam,Ganesh; Hammond,Gary, Method and apparatus for lowering the die temperature of a microprocessor and maintaining the temperature below the die burn out.
    상세보기
  35. Borys S. Senyk, Method and apparatus for monitoring the temperature of a processor.
    상세보기
  36. Pippin Jack D., Method and apparatus for programmable thermal sensor for an integrated circuit.
    상세보기
  37. Pippin,Jack D., Method and apparatus for programmable thermal sensor for an integrated circuit.
    상세보기
  38. Pedoeem, Albert; Brolin, Steven J.; Burnell, James F., Method and system for monitoring the thermal status of a card shelf.
    상세보기
  39. Corbett,Jesse V.; Steiner,David J.; Johnson,Donald C., Method of removing foreign particles from heat transfer surfaces of heat sinks.
    상세보기
  40. Gunther, Stephen H.; Binns, Frank; Pippin, Jack D.; Rankin, Linda J.; Burton, Edward A.; Carmean, Douglas M.; Bauer, John M., Methods and apparatus for thermal management of an integrated circuit die.
    상세보기
  41. Gunther,Stephen H.; Binns,Frank; Pippin,Jack D.; Rankin,Linda J.; Burton,Edward A.; Carmean,Douglas M.; Bauer,John M., Methods and apparatus for thermal management of an integrated circuit die.
    상세보기
  42. Cohen,Guy M.; Reznicek,Alexander; Saenger,Katherine L.; Yang,Min, Mixed orientation and mixed material semiconductor-on-insulator wafer.
    상세보기
  43. Chen, Fen; Sullivan, Timothy D., Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuits.
    상세보기
  44. Chen, Fen; Sullivan, Timothy D., Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuits.
    상세보기
  45. Ryan, John T., Peltier-cooled LED lighting assembly.
    상세보기
  46. DeVilbiss Roger S. (Dallas TX) Quisenberry Tony M. (Highland Village TX) Powell ; Jr. Harry C. (Shipman VA), Power control circuit for improved power application and temperature control of low voltage thermoelectric devices.
    상세보기
  47. Tracewell Larry L. ; Tracewell Matthew S. ; Kociecki John, Power supply and power supply/backplane assembly and system.
    상세보기
  48. Linda J. Rankin ; Edward A. Burton ; Stephen H. Gunther ; Jack D. Pippin, Programmable thermal management of an integrated circuit die.
    상세보기
  49. Morris Garron K. ; Pal Debabrata ; Pais Martin R., Semiconductor circuit temperature monitoring and controlling apparatus and method.
    상세보기
  50. Yoshida, Tadafumi; Osada, Hiroshi; Yokoi, Yutaka, Semiconductor device including power semiconductor element, branch line, and thermoelectric conversion element, and electrically powered vehicle.
    상세보기
  51. Chang,Chien Lung; He,Hui; Wu,Chih Peng, Series-connected heat dissipater coupled by heat pipe.
    상세보기
  52. Hamilton, Harold E.; Conroy, Chad M.; Bloch, Brian R., Shutters for burn-in-board connector openings.
    상세보기
  53. Crippen,Martin Joseph; Matteson,Jason Aaron; Piazza,William Joseph, System, method, and apparatus for providing a thermal bypass in electronic equipment.
    상세보기
  54. Lanning, Eric J., Tap board.
    상세보기
  55. Pippin, Jack D., Temperature averaging thermal sensor apparatus and method.
    상세보기
  56. Strnad, Richard J., Temperature control method for integrated circuit.
    상세보기
  57. Richard J. Strnad, Temperature control structure for integrated circuit.
    상세보기
  58. DeVilbiss Roger S. (Dallas TX) Powell Harry C. (Shipman VA), Temperature controller for low voltage thermoelectric cooling or warming boxes and method therefor.
    상세보기
  59. Beatty Timothy S. ; McAllister Christopher P. ; Fletcher Thomas D., Temperature measurement and compensation scheme.
    상세보기
  60. Pippin, Jack D., Temperature-based clock frequency controller apparatus and method.
    상세보기
  61. Pippin, Jack D., Temperature-based cooling device controller apparatus and method.
    상세보기
  62. Pippin, Jack D., Temperature-based cooling device controller apparatus and method.
    상세보기
  63. Peszynski Michael (Newburyport MA), Thermal sink for a transducer assembly.
    상세보기
  64. Cross David A.,GBX, Thermally aided power sharing of power supplies with or without an external current share line.
    상세보기
  65. Robert W. Otey, Thermoelectric module with thin film substrates.
    상세보기
  66. Buer Kenneth Vern ; Corman David Warren ; Torkington Richard Scott, Thermoelectrically cooled low noise amplifier and method.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로