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Cooling structure for heat generating electronic components mounted on a substrate 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0222818 (1988-07-21)
우선권정보 JP-0185182 (1987-07-24); JP-0189201 (1987-07-29); JP-0204168 (1987-08-19); JP-0157800 (1987-10-15)
발명자 / 주소
  • Mine Shinji (Tokyo JPX) Shimonishi Terumi (Tokyo JPX)
출원인 / 주소
  • NEC Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 39  인용 특허 : 40

초록 ▼

A cooling structure for heat generating electronic components mounted on a substrate. The cooling structure includes a cold plate fixed on the substrate which is provided with first through holes opposed to the respective upper surfaces of the heat generating electronic components, flow paths formed

대표청구항 ▼

A cooling structure comprising: heat generating electronic components mounted on a substrate; a cold plate fixed on said substrate which is provided with cold plate through holes opposed to the respective upper surfaces of said heat generating electronic components; flow paths formed within said col

이 특허에 인용된 특허 (40)

  1. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
    상세보기
  2. Cutchaw, John M., Apparatus for cooling high-density integrated circuit packages.
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  3. Mathias Joseph S. (Riverton NJ) Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
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  4. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips with forced coolant jet.
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  5. Faretra Ronald A. (Melrose MA), Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface.
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  6. Baldwin Graham J. (Cheltenham GB2) McCann Michael O. (Wotton-Under-Edge GB2), Chip-carrier substrates.
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  7. August Melvin C. (Chippewa Falls WI) Williams John T. (Chippewa Falls WI), Circuit module with enhanced heat transfer and distribution.
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  8. Kaufman, Lance R., Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink.
    상세보기
  9. Ahmann Gerald L. (St. Paul MN) Carlson Douglas M. (Anoka MN) Marquardt Warren B. (Stillwater MN) Offerdahl Richard E. (Shoreview MN) Paulson Roger A. (New Brighton MN) Vacca Anthony A. (New Brighton , Circuit packaging and cooling.
    상세보기
  10. Arii Hiroshi (Kawasaki JPX) Kawada Hirohito (Mitaka JPX) Yoshida Takashi (Tokyo JPX) Nonaka Chiaki (Tokyo JPX), Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat con.
    상세보기
  11. Hagihara Takashi (Tokyo JPX) Kuramitsu Yuzi (Tokyo JPX), Cooling equipment for an integrated circuit chip.
    상세보기
  12. Nakanishi Keiichirou (Kokubunji JPX) Yamada Minoru (Iruma JPX) Masaki Akira (Meguro JPX) Imai Kuninori (Shiroyama JPX) Chiba Katuaki (Kokubunji JPX), Cooling module for integrated circuit chips.
    상세보기
  13. Maruyama Kazuo (Tokyo JPX), Cooling structure for integrated circuits.
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  14. Mizuno Tsukasa (Tokyo JPX), Cooling system.
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  15. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Inagi JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko, Cooling system for an electronic circuit device.
    상세보기
  16. Hutchison ; Robert V. ; Gregg ; Peter P. ; MacBride ; James J., Cooling system for dual-in-line packages.
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  17. Kikuchi Shunichi (Yokohama JPX) Matsunaga Haruyuki (Atsugi JPX) Katsumi Hideo (Sagamihara JPX) Katsuyama Koji (Yokohama JPX), Cooling system for electronic circuit components.
    상세보기
  18. Mizuno Tsukasa (Tokyo JPX) Okano Minoru (Tokyo JPX), Cooling system for electronic equipment.
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  19. Chu ; Bing-Lun ; Subbarao ; Wunnava Venkata ; Peale ; Jack ; McCune ; Ke nt ; Steiner ; Marvin Elroy, D-I-P On island.
    상세보기
  20. Yamada Minoru (Iruma JPX) Usui Mitsuru (Yokohama JPX) Masaki Akira (Tokyo JPX) Nakanishi Keiichirou (Kokubunji JPX) Tokuda Masahide (Hachioji JPX), Device for cooling integrated circuit chip.
    상세보기
  21. Munekawa Masaaki (Oyama JPX), Device for releasing heat.
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  22. Morrison Robert A. (Granada Hills CA) Frink Attila (Northridge CA), Electronic packaging module utilizing phase-change conductive cooling.
    상세보기
  23. Goetzke ; Siegfried ; Jakob ; Gert, Environmentally protected electronic housing and heat sink structure, particularly for automotive use.
    상세보기
  24. Wilson ; Edward A. ; Fredenberg ; James D., Fluid cooling systems for electronic systems.
    상세보기
  25. Chu Richard C. (Poughkeepsie NY) Gupta Omkarnath R. (Poughkeepsie NY) Hwang Un-Pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Gas encapsulated cooling module.
    상세보기
  26. Watari Toshihiko (Tokyo JPX) Umeta Junzo (Tokyo JPX), High density LSI package for logic circuits.
    상세보기
  27. Kucharek Andrzej (Mountain View CA), High density multi-chip interconnection and cooling package.
    상세보기
  28. Rainal Attilio J. (Convent Station NJ), High-speed, high pin-out LSI chip package.
    상세보기
  29. Barrett, Howard W.; Fledderjohann, Paul F., Indirect cooling of electronic circuits.
    상세보기
  30. Murano Hiroshi (Tokyo JPX) Akino Moritoshi (Tokyo JPX), Integrated circuit chip package for logic circuits.
    상세보기
  31. Fick Herbert J. (Northfield MN), Interfacing of heat sinks with electrical devices, and the like.
    상세보기
  32. Kuramitsu Yuji (Tokyo JPX) Yamaguchi Yukio (Tokyo JPX), Liquid cooling system for integrated circuit chips.
    상세보기
  33. DeGree David C. (Burnsville MN) Bergquist Carl R. (Minnetonka MN) Humphrey Dallas R. (Golden Valley MN) West Roger A. (Woodbury MN), Method of making a mounting base pad for semiconductor devices.
    상세보기
  34. DeGree David C. (Burnsville MN) Fick Herbert J. (Northfield MN) Juenger Bruce H. (Northfield MN), Mounting pad for solid-state devices.
    상세보기
  35. West Roger A. (Woodbury MN) Humphrey Dallas R (Golden Valley MN) Bergquist Carl R. (Minnetonka MN) DeGree David C. (Burnsville MN), Mounting pad with tubular projections for solid-state devices.
    상세보기
  36. Feinberg Irving (Poughkeepsie NY) Langdon Jack L. (Poughkeepsie NY), Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices.
    상세보기
  37. Nicol Edward A. (San Diego CA) Adrian George J. (San Diego CA), Self-aligning liquid-cooling assembly.
    상세보기
  38. Keryhuel Alain (Pavilly FRX) Meigne Christian (Barentin FRX), Semiconductor package with contact springs.
    상세보기
  39. Groh Leon H. (Los Gatos CA), Shock-mounted, liquid cooled cold plate assembly.
    상세보기
  40. Tustaniwskyj Jerry I. (Mission Viejo CA) Halkola Kyle G. (San Diego CA), Spring loaded module for cooling integrated circuit packages directly with a liquid.
    상세보기

이 특허를 인용한 특허 (39)

  1. Dibene, II, Joseph T.; Hartke, David H.; Derian, Edward J.; Hoge, Carl E.; Broder, James M.; San Andres, Jose B.; Riel, Joseph S., Apparatus for delivering power to high performance electronic assemblies.
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  2. Joseph Ted Dibene, II ; David H. Hartke ; James Hjerpe Kaskade ; Carl E. Hoge, Apparatus for providing power to a microprocessor with integrated thermal and EMI management.
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  3. Michael Brownell ; Gregory Turturro ; Dan McCutchan, Controlled bondline thickness attachment mechanism.
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  4. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
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  5. Chester, Daniel; Hopton, Peter; Bent, Jason; Deakin, Keith, Cooled electronic system.
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  6. Di Stefano, Peter T.; Di Stefano, Thomas H., Cooling apparatus for microelectronic devices.
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  7. Koide Hiromichi,JPX ; Suzuki Shinya,JPX ; Tano Ichiro,JPX, Cooling system of a printed board.
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  8. Busch, Klaus; Deinhardt, Günther; Reinhard, Alexander; Wiesner, Christoph, Cooling system, cold plate and assembly having a cooling system.
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  9. Meschter Stephan John ; Miller Gary ; Burdick Mark Richard ; Kane Joseph Edward, Electronic module with conductively heat-sunk components.
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  10. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Fabricating multi-component electronic module with integral coolant-cooling.
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  11. Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX), Flat cooling structure of integrated circuit.
    상세보기
  12. Dugas, Roger, Inside-out heat sink.
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  13. Dugas, Roger, Inside-out heat sink.
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  14. Dugas, Roger, Inside-out heat sink.
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  15. Hartke, David H.; DiBene, II, Joseph Ted, Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems.
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  16. Dibene ; II Joseph Ted ; Hartke David, Inter-circuit encapsulated packaging.
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  17. Joseph Ted DiBene, II ; David Hartke, Inter-circuit encapsulated packaging for power delivery.
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  18. D'Onofrio, Nicholas Michael, Liquid cooled metal core printed circuit board.
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  19. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
    상세보기
  20. DiBene, II,Joseph T.; Hartke,David H.; Kaskade,James J. Hjerpe; Hoge,Carl E., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
    상세보기
  21. Otsuki Tetsuya,JPX, Method of making a multiple heat sink resin sealing type semiconductor device.
    상세보기
  22. Kreissig, Gerald; Bollinger, Wolfgang; Dieterle, Roland; Droege, Hartmut, Method of providing flexible heat sink installations for early blade board manufacturing.
    상세보기
  23. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
    상세보기
  24. Kuroda, Mitsuru, Mounting structure of electronic parts.
    상세보기
  25. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Multi-component electronic module with integral coolant-cooling.
    상세보기
  26. Arvelo, Amilcar R.; Campbell, Levi A.; Ellsworth, Jr., Michael J.; McKeever, Eric J., Multi-component electronic module with integral coolant-cooling.
    상세보기
  27. Otsuki Tetsuya,JPX, Resin sealing type semiconductor device.
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  28. Otsuki Tetsuya (Suwa JPX), Resin sealing type semiconductor device and method of making the same.
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  29. Otsuki Tetsuya (Suwa JPX), Resin sealing type semiconductor device and method of making the same.
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  30. Otsuki Tetsuya,JPX, Resin sealing type semiconductor device and method of making the same.
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  31. Otsuki Tetsuya,JPX ; Ito Tadami,JPX, Resin sealing type semiconductor device having thin portions formed on the leads.
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  32. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
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  33. Ootsuki Tetsuya (Nagano-ken JPX), Semiconductor device having a heat radiator.
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  34. Ootsuki Tetsuya (Nagano-ken JPX) Hama Norikata (Nagano-ken JPX), Semiconductor device with a convex heat sink.
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  35. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
    상세보기
  36. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
    상세보기
  37. Chengalva,Suresh K.; Oberlin,Gary E.; Walsh,Matthew R., Thermally enhanced electronic module with self-aligning heat sink.
    상세보기
  38. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
    상세보기
  39. Dugas,Roger; Frushour,Ross L., Wing portion of a butterfly-style inside-out heat sink.
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