초록 ▼

A cathode sputtering system for coating substrates in a vacuum chamber in which a rotating substrate carrier is accommodated and comprises at least one conveyor spoon. The conveyor spoon comprises a substrate receptacle member and an arm attached between the receptacle member and a rotating disk. Th

A cathode sputtering system for coating substrates in a vacuum chamber in which a rotating substrate carrier is accommodated and comprises at least one conveyor spoon. The conveyor spoon comprises a substrate receptacle member and an arm attached between the receptacle member and a rotating disk. The arm preferably comprises two leaf springs arranged parallel to one another. During the sputtering process, a pressure plate presses the substrate receptacle member and the substrate against a mask that is part of the cathode station. As a result, a cathode vacuum space is formed that is isolated from the vacuum space of the system.

대표청구항 ▼

A cathode sputtering system for coating substrates in a vacuum chamber, comprising: a rotating substrate carrier positioned within the chamber, the substrate carrier including at least one conveyor spoon that extends radially from a central axis of the chamber, the conveyor spoon including a substra

A cathode sputtering system for coating substrates in a vacuum chamber, comprising: a rotating substrate carrier positioned within the chamber, the substrate carrier including at least one conveyor spoon that extends radially from a central axis of the chamber, the conveyor spoon including a substrate receptacle member positioned at a radial end of the spoon, the substrate receptacle member being axially movable along the axis of rotation; a sputtering cathode station operatively attached to and in communication with the chamber; a loading station operatively attached to and in communication with the chamber; and an unloading station operatively attached to and in communication with the chamber.