초록

A resin composition for printed circuit board comprising: (A) 30-90% by weight of a liquid crystal polyester, (B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 mm

대표청구항 ▼

A resin composition for printed circuit board comprising: (A) 30-90% by weight of a liquid crystal polyester having one of the following combinations of repeating units: [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] wherein X is alkyl, halogen or aryl, (B)

A resin composition for printed circuit board comprising: (A) 30-90% by weight of a liquid crystal polyester having one of the following combinations of repeating units: [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] [Figure] wherein X is alkyl, halogen or aryl, (B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 m200 m3-30% by weight of an alkaline earth metal carbonate. A composition according to claim 1 further comprising at least one member selected from the group consisting of an antioxidant, a heat stabilizer, an ultraviolet absorber, a lubricant, a releasing agent, a dye, a pigment, a flame retardant, a flame-retarding aid, an antistatic agent, thermoplastic resins consisting of a polyamide, a polyester, a polyphenylene sulfide, a polyetherketone, a polycarbonate, a modified polyphenylene oxide, a polysulfone, a polyetherimide and a polyamideimide, and thermosetting resins consisting of a phenolic resin, an epoxy resin and a polyimide resin.