초록 ▼

A printed circuit is formed by conventional methods over an adhesive coating applied to a flexible high temperature withstandability disposable backing to form a flexible laminate which is positioned in a cavity of an injection mold to conform to surface variations. The printed circuit conductors ar

A printed circuit is formed by conventional methods over an adhesive coating applied to a flexible high temperature withstandability disposable backing to form a flexible laminate which is positioned in a cavity of an injection mold to conform to surface variations. The printed circuit conductors are surrounded on three sides by molten plastic material injected into the mold cavity to embed the conductors in the respective surfaces of the molded plastic article, which surfaces are non-coplanar and adjoining and the conductors are continuous from one surface to the other. The bond strength of the adhesive is preferably high with regard to the backing and low with regard to the printed circuit conductors to permit adhesive and backing to be peeled away after molding, thereby providing a three diemensional printed circuit in, for example, a recessed area of a molded plastic housing part of electrical apparatus.

대표청구항 ▼

A method of providing a molded plastic article having a continuous conductive printed circuit embedded in at least two adjoining non-coplanar recessed surfaces of said article with an exposed surface of said printed circuit substantially flush with said recessed surfaces in which it is embedded, com

A method of providing a molded plastic article having a continuous conductive printed circuit embedded in at least two adjoining non-coplanar recessed surfaces of said article with an exposed surface of said printed circuit substantially flush with said recessed surfaces in which it is embedded, comprising: providing a flexible temporary backing member; applying an adhesive coating to one surface of said backing member; providing a conductive printed circuit on said adhesive coating providing an injection mold having a cavity defined by at least two adjoining non-coplanar cavity defining surfaces; positioning and flexibly conforming said backing concurrently against each said adjoining non-coplanar cavity-defining surface of said injection mold with said conductive printed circuit disposed within said mold cavity defined by said surfaces, said printed circuit extending continuously from one said adjoining cavity-defining surface to another said adjoining cavity-defining surface; injecting plastic into said mold cavity around three sides of said conductive printed circuit; releasing said plastic from said mold as said molded plastic article with said conductive printed circuit embedded in said at least two adjoining non-coplanar recessed surfaces of said article and said backing affixed to said conductive printed circuit by said adhesive, said circuit being continuous between said adjoining non-coplanar surfaces; and peeling said backing and said adhesive from said conductive printed circuit, leaving a fourth side of said conductive printed circuit forming said exposed surface which is substantially flush with said article surfaces in which it is embedded.