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Cooling unit

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-027/02
출원번호 US-0403828 (1989-09-07)
우선권정보 JP-0225843 (1988-09-09)
발명자 / 주소
  • Umezawa Kazuhiko (Tokyo JPX)
출원인 / 주소
  • NEC Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 21  인용 특허 : 47

초록

A cooling unit includes a coolant inlet through which a cooling coolant flows into the coding unit, a plurality of devices to be cooled which are connected to the coolant inlet in parallel, a coolant outlet through which the cooling coolant flows out from the cooling unit to the devices, a plurality

대표청구항

A cooling unit comprising: a coolant inlet through which a cooling coolant flows into said cooling unit; a plurality of devices to be cooled which are connected to the coolant inlet in parallel; a coolant outlet through which the cooling coolant flows out from said cooling unit to said plurality of

이 특허에 인용된 특허 (47)

  1. Tajima Tsuneaki (Tokyo JPX) Matsuo Yohichi (Tokyo JPX), Air cooling equipment for electronic systems.
  2. Cutchaw, John M., Apparatus for cooling high-density integrated circuit packages.
  3. Mathias Joseph S. (Riverton NJ) Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
  4. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips with forced coolant jet.
  5. Faretra Ronald A. (Melrose MA), Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface.
  6. Baldwin Graham J. (Cheltenham GB2) McCann Michael O. (Wotton-Under-Edge GB2), Chip-carrier substrates.
  7. August Melvin C. (Chippewa Falls WI) Williams John T. (Chippewa Falls WI), Circuit module with enhanced heat transfer and distribution.
  8. Kaufman, Lance R., Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink.
  9. Ahmann Gerald L. (St. Paul MN) Carlson Douglas M. (Anoka MN) Marquardt Warren B. (Stillwater MN) Offerdahl Richard E. (Shoreview MN) Paulson Roger A. (New Brighton MN) Vacca Anthony A. (New Brighton , Circuit packaging and cooling.
  10. Arii Hiroshi (Kawasaki JPX) Kawada Hirohito (Mitaka JPX) Yoshida Takashi (Tokyo JPX) Nonaka Chiaki (Tokyo JPX), Cooling assembly for cooling electrical parts wherein a heat pipe is attached to a heat conducting portion of a heat con.
  11. Hagihara Takashi (Tokyo JPX) Kuramitsu Yuzi (Tokyo JPX), Cooling equipment for an integrated circuit chip.
  12. Nakanishi Keiichirou (Kokubunji JPX) Yamada Minoru (Iruma JPX) Masaki Akira (Meguro JPX) Imai Kuninori (Shiroyama JPX) Chiba Katuaki (Kokubunji JPX), Cooling module for integrated circuit chips.
  13. Maruyama Kazuo (Tokyo JPX), Cooling structure for integrated circuits.
  14. Mizuno Tsukasa (Tokyo JPX), Cooling system.
  15. Yamamoto Haruhiko (Yokohama JPX) Suzuki Masahiro (Inagi JPX) Udagawa Yoshiaki (Tokyo JPX) Nakata Mitsuhiko (Kawasaki JPX) Katsuyama Koji (Yokohama JPX) Ono Izumi (Hachioji JPX) Kikuchi Shunichi (Yoko, Cooling system for an electronic circuit device.
  16. Hutchison ; Robert V. ; Gregg ; Peter P. ; MacBride ; James J., Cooling system for dual-in-line packages.
  17. Kikuchi Shunichi (Yokohama JPX) Matsunaga Haruyuki (Atsugi JPX) Katsumi Hideo (Sagamihara JPX) Katsuyama Koji (Yokohama JPX), Cooling system for electronic circuit components.
  18. Mizuno Tsukasa (Tokyo JPX) Okano Minoru (Tokyo JPX), Cooling system for electronic equipment.
  19. Mine Shinji (Tokyo JPX), Cooling system for three-dimensional IC package.
  20. Chu ; Bing-Lun ; Subbarao ; Wunnava Venkata ; Peale ; Jack ; McCune ; Ke nt ; Steiner ; Marvin Elroy, D-I-P On island.
  21. Yamada Minoru (Iruma JPX) Usui Mitsuru (Yokohama JPX) Masaki Akira (Tokyo JPX) Nakanishi Keiichirou (Kokubunji JPX) Tokuda Masahide (Hachioji JPX), Device for cooling integrated circuit chip.
  22. Munekawa Masaaki (Oyama JPX), Device for releasing heat.
  23. Morrison Robert A. (Granada Hills CA) Frink Attila (Northridge CA), Electronic packaging module utilizing phase-change conductive cooling.
  24. Goetzke ; Siegfried ; Jakob ; Gert, Environmentally protected electronic housing and heat sink structure, particularly for automotive use.
  25. Wilson ; Edward A. ; Fredenberg ; James D., Fluid cooling systems for electronic systems.
  26. Chu Richard C. (Poughkeepsie NY) Gupta Omkarnath R. (Poughkeepsie NY) Hwang Un-Pah (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY), Gas encapsulated cooling module.
  27. Watari Toshihiko (Tokyo JPX) Umeta Junzo (Tokyo JPX), High density LSI package for logic circuits.
  28. Kucharek Andrzej (Mountain View CA), High density multi-chip interconnection and cooling package.
  29. Rainal Attilio J. (Convent Station NJ), High-speed, high pin-out LSI chip package.
  30. Barrett, Howard W.; Fledderjohann, Paul F., Indirect cooling of electronic circuits.
  31. Murano Hiroshi (Tokyo JPX) Akino Moritoshi (Tokyo JPX), Integrated circuit chip package for logic circuits.
  32. Fick Herbert J. (Northfield MN), Interfacing of heat sinks with electrical devices, and the like.
  33. Kuramitsu Yuji (Tokyo JPX) Yamaguchi Yukio (Tokyo JPX), Liquid cooling system for integrated circuit chips.
  34. Hagihara Takashi (Tokyo JPX), Method for producing semiconductor module.
  35. DeGree David C. (Burnsville MN) Bergquist Carl R. (Minnetonka MN) Humphrey Dallas R. (Golden Valley MN) West Roger A. (Woodbury MN), Method of making a mounting base pad for semiconductor devices.
  36. Hagihara Takashi (Tokyo JPX) Kuramitsu Yuzi (Tokyo JPX), Method of producing a cooled electronic assembly.
  37. Carroll ; II Arthur E. (Raytown MO) Lewis ; Jr. Basil C. (Reading PA) Yeazel Howard T. (Leawood KS), Methods of packaging an electronic device.
  38. DeGree David C. (Burnsville MN) Fick Herbert J. (Northfield MN) Juenger Bruce H. (Northfield MN), Mounting pad for solid-state devices.
  39. West Roger A. (Woodbury MN) Humphrey Dallas R (Golden Valley MN) Bergquist Carl R. (Minnetonka MN) DeGree David C. (Burnsville MN), Mounting pad with tubular projections for solid-state devices.
  40. Feinberg Irving (Poughkeepsie NY) Langdon Jack L. (Poughkeepsie NY), Package for mounting and interconnecting a plurality of large scale integrated semiconductor devices.
  41. Marchisi Giuseppe (Via A. Pecorini ; 8 20100-Milano ITX), Process for manufacturing plastic containers incorporating a heat disperser for integrated circuits.
  42. Nicol Edward A. (San Diego CA) Adrian George J. (San Diego CA), Self-aligning liquid-cooling assembly.
  43. Keryhuel Alain (Pavilly FRX) Meigne Christian (Barentin FRX), Semiconductor package with contact springs.
  44. Groh Leon H. (Los Gatos CA), Shock-mounted, liquid cooled cold plate assembly.
  45. Tustaniwskyj Jerry I. (Mission Viejo CA) Halkola Kyle G. (San Diego CA), Spring loaded module for cooling integrated circuit packages directly with a liquid.
  46. Watanabe Hideo (Kanagawa JPX), Temperature controller for semiconductor device.
  47. Watanabe Hideo (Kaisei JPX), Temperature controller for semiconductor devices.

이 특허를 인용한 특허 (21)

  1. Limper-Brenner Linda ; Schmidt Detlef W. ; McDunn Kevin J. ; Press Minoo D., Apparatus and method for mounting an electronic component to a substrate and method for spray-cooling an electronic comp.
  2. McDunn Kevin J. (Lake in the Hills IL) Limper-Brenner Linda (Glenview IL) Press Minoo D. (Schaumburg IL), Apparatus and method for shielding an electronic module from electromagnetic radiation.
  3. Ballard Gerald W. (West Dundee IL) Turocy James W. (Arlington Heights IL) Beise Thomas R. (Hoffman Estates IL), Apparatus and method for spray-cooling an electronic module.
  4. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus and method for spray-cooling an electronic module.
  5. Weber, Richard M., Apparatus for cooling with coolant at subambient pressure.
  6. McDunn Kevin J. ; Limper-Brenner Linda ; Press Minoo D., Apparatus for spray-cooling multiple electronic modules.
  7. Di Stefano, Thomas H., Apparatus to control device temperature utilizing multiple thermal paths.
  8. Di Stefano, Thomas H., Apparatus to control device temperature utilizing multiple thermal paths.
  9. Umezawa Kazuhiko (Tokyo JPX) Komatsu Toshiaki (Tokyo JPX) Kubokawa Jun (Yamanashi JPX), Flat cooling structure of integrated circuit.
  10. Semedard Jean-Claude,FRX ; Gauville Pierre,FRX ; Enault Christian,FRX, Heat exchanger system for a boiler having a circulating fluidized bed.
  11. Di Stefano, Thomas H., Method and apparatus for controlling temperature.
  12. Weber, Richard M.; Wyatt, William G.; Rummel, Kerrin A., Method and apparatus for cooling electronics with a coolant at a subambient pressure.
  13. Weber,Richard M., Method and apparatus for cooling with coolant at a subambient pressure.
  14. Weber,Richard Martin; Wyatt,William Gerald, Method and apparatus for cooling with coolant at a subambient pressure.
  15. Wyatt, William Gerald; Weber, Richard M., Method and apparatus for extracting non-condensable gases in a cooling system.
  16. Aniekan Udobot ; Ron Brager ; Larry Reed, Method and apparatus for improved aircraft environmental control system utilizing parallel heat exchanger arrays.
  17. Haws, James L.; Wyatt, William Gerald; Kviatkofsky, James F.; Denniston, David B., Method and apparatus for removing heat from a circuit.
  18. Di Stefano, Peter T.; Di Stefano, Thomas H., Method and apparatus for setting and controlling temperature.
  19. Price, Donald C.; Wyatt, William Gerald; Schwartz, Gary J., Method and system for cooling.
  20. Wyatt, William G.; Weber, Richard M., System and method for separating components of a fluid coolant for cooling a structure.
  21. Weber, Richard M.; Rummel, Kerrin A.; Payton, Albert P., System and method of boiling heat transfer using self-induced coolant transport and impingements.
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