초록 ▼

A method and apparatus for monitoring layer erosion in a dry-etching process. The apparatus has a first electrode that is electrically connected to a substrate to be etched, as well as a second electrode that is located above the first electrode. Both electrodes are situated inside a process chamber

A method and apparatus for monitoring layer erosion in a dry-etching process. The apparatus has a first electrode that is electrically connected to a substrate to be etched, as well as a second electrode that is located above the first electrode. Both electrodes are situated inside a process chamber. An optical photometer is positioned outside of the process chamber and directed onto the substrate in the process chamber. Signals received from the optical photometer are amplified by an electrical circuit and are edited and displayed with a Fourier transformation. The etching process can be automatically interrupted when received periodic signals having essentially constant amplitude and frequency undergo a significant change during the etching process of the upper layer. That is, they are received as signals signficantly deviating from one another, this being identified by the electrical circuit as the passage from one layer to another layer of the substrate during the dry-etching process.

대표청구항 ▼

A method for monitoring layer erosion of layers on at least one substrate in a dry-etching process, having a first electrode that electrically contacts the substrate to be etched and a second electrode that is located above the first electrode, both electrodes being situated inside a process chamber

A method for monitoring layer erosion of layers on at least one substrate in a dry-etching process, having a first electrode that electrically contacts the substrate to be etched and a second electrode that is located above the first electrode, both electrodes being situated inside a process chamber, comprising the steps of: placing an optical photometer outside of the process chamber and reflecting a light beam off of the substrate in the process chamber by means of the photometer, signals output by the optical photometer being amplified by an electrical circuit and being edited and displayed by means of a Fourier transformation.