초록 ▼

A TO can-style plug-in package employs a pin/glass interface. In a first embodiment the pin/glass seal interface has a center pin of reduced diameter embedded in a smaller outer diameter, lower dielectric constant glass than a conventional TO-can. The glass is surrounded by a metal ferrule. The meta

A TO can-style plug-in package employs a pin/glass interface. In a first embodiment the pin/glass seal interface has a center pin of reduced diameter embedded in a smaller outer diameter, lower dielectric constant glass than a conventional TO-can. The glass is surrounded by a metal ferrule. The metallic header through which the pin/glass interfaces extend is provided with a ridge adjacent to the end of a respective pin. This increase in thickness of the header surrounding each glass-embedded center pin provides a prescribed capacitive reactance component for compensating the inductive reactance of the interiorly extending segment of the center pin and any connecting lead through which the microwave integrated component is coupled to the pin. In a second embodiment, the thickness of insulator glass that surrounds the center conductor is less than the thickness of the header.

대표청구항 ▼

A plug-in package for housing circuit components comprising: a conductive support header upon which one or more circuit components are mounted, said support header having at least one aperture therethrough extending from an interior portion of said package, whereat a respective one of said one or mo

A plug-in package for housing circuit components comprising: a conductive support header upon which one or more circuit components are mounted, said support header having at least one aperture therethrough extending from an interior portion of said package, whereat a respective one of said one or more circuit components is mounted, to an exterior portion thereof; a respective conductor pin supported within and extending through a respective one of said at least one aperture, said conductor pin being conductively coupled to said respective one circuit component at a first portion thereof at said interior portion of said package, said pin forming an inductive reactance component between said respective one circuit component and the exterior of said package; and a respective dielectric insulator surrounding said respective conductor pin and being mechanically coupled to said header so as to support said respective conductor pin in a respective at least one aperture; and wherein a prescribed region of said aperture through which said pin extends has a dielectric constant different from that of said insulator so as to form a prescribed capacitive reactance between said pin and said header, and forms with the inductive reactance of said pin a prescribed inductive-capacitance impedance matching network between said respective one circuit component and the exterior of said package, and wherein said support header has a pair of opposite, substantially parallel surfaces through which said respective at least one aperture extends, a first of said surfaces corresponding to said interior portion of said package and supporting said respective one circuit component thereon; and wherein said package is adapted to be mounted on a conductive transmission line support member having a respective at least one aperture therein for receiving said conductor pin; and wherein said aperture in said support header is a generally cylindrical aperture of a constant diameter extending through said header and the aperture in said conductive transmission line support member has a circular cross-section, a first portion of the support member aperture having a diameter corresponding to that of the generally cylindrical aperture in said header and is formed so as to be aligned with the aperture in said header, and wherein the thickness of said dielectric insulator through said header is less than the length of the aperture in said header so as to form an airspace surrounding a prescribed portion of said conductor pin in both the aperture in said header and the aperture in said support member in alignment therewith, said airspace corresponding to said prescribed region whereat said prescribed capacitive reactance is formed between said conductor pin and the conductive material of said header and said support member.