초록 ▼

The invention is an improved integrated circuit chip assembly which provides enhanced heat transfer from active electronic devices of the integrated circuit by significantly reducing the thickness of the substrate and providing the necessary structural support through a thermally conducting spacing

The invention is an improved integrated circuit chip assembly which provides enhanced heat transfer from active electronic devices of the integrated circuit by significantly reducing the thickness of the substrate and providing the necessary structural support through a thermally conducting spacing segment between the substrate and a ground plane in the region of the active electronic devices. This improvement further permits added flexibility in the design of transmission lines by permitting adjustment of the distance between the transmission line and the ground plane and furthermore by permitting the introduction of a second dielectric material such that the impedance of the transmission line may be controlled.

대표청구항 ▼

In an integrated circuit chip assembly having an integrated circuit and at least one microstrip transmission line disposed on a first side of a dielectric substrate and a ground plane acting at least as a heat sink, with the substrate further having a second surface and a predetermined thickness, th

In an integrated circuit chip assembly having an integrated circuit and at least one microstrip transmission line disposed on a first side of a dielectric substrate and a ground plane acting at least as a heat sink, with the substrate further having a second surface and a predetermined thickness, the integrated circuit having at least one heat generating electronic device within the substrate occupying an area on the substrate, the ground plane having a first and second surface and the at least one transmission line disposed on the substrate first surface and spaced apart from the electronic device, the improvement comprising: a spacing segment associated with each heat generating device comprised of a material having high thermal conductivity and low electrical conductivity selectively interposed between the first surface of the ground plane and the second surface of the substrate, the segment having an area approximately equal to and approximately conforming to the heat generating device area and positioned against the substrate second surface in a region opposite the heat generating device such that the segment provides a path for heat transfer from the electronic device on the substrate to the ground plane and each segment further provides structural reinforcement to the assembly to permit a smaller substrate thickness and enhance heat transfer from the device to the ground plane.