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Bellows heat pipe for thermal control of electronic components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • E28D-015/02
  • F28F-027/00
  • H01L-023/427
출원번호 US-0211571 (1988-06-27)
발명자 / 주소
  • Peterson George P. (College Station TX) Oktay Sevgin (Poughkeepsie NY)
출원인 / 주소
  • Texas A & M University System (The College Station TX 02)
인용정보 피인용 횟수 : 47  인용 특허 : 7

초록

A bellows type heat pipe which conducts heat away from an electronic device to a heat sink. The heat pipe is a sealed bellows type container which has an evaporator section at one end and a condenser section at an opposite end. The evaporator section contains a saturated radial wick while the conden

대표청구항

Apparatus for conducting heat away from an electronic device, which comprises: (a) a heat pipe comprising a flexible bellows member terminating in an evaporator section at one end and a condenser section at an opposite end, a first wick lining said evaporator section; a second wick lining said conde

이 특허에 인용된 특허 (7)

  1. Eastman, Dean E.; Eldridge, Jerome M.; Petersen, Kurt E.; Olive, Graham, Cooling system for VLSI circuit chips.
  2. Meeker Robert G. (La Grangeville NY) Scanlon William J. (Hopewell Junction NY) Segal Zvi (Wappingers Falls NY), Gas encapsulated cooling module.
  3. Wolf David A. (Baltimore MD), Heat pipe thermal switch.
  4. Garrett Robert W. (Reading PA), Method and apparatus for removing heat from a workpiece during processing in a vacuum chamber.
  5. Andros Frank E. (Binghamton NY) Shay Robert J. E. (Bath NY), Micro bellows thermo capsule.
  6. Andros Frank E. (Binghamton NY) Shay Robert J. E. (Salisbury NC), Micro helix thermo capsule.
  7. Altoz Frank E. (Baltimore MD) Porter Richard F. (Millersville MD), Thermal switch.

이 특허를 인용한 특허 (47)

  1. Stuckey, Larry, Advanced thermal control interface.
  2. Wayburn,Lewis S.; Spearing,Ian G.; Schmidt, Jr.,Charles R., Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test.
  3. Herring,Dean Frederick; Kamath,Vinod; Wormsbecher,Paul Andrew, Apparatus and system for cooling heat producing components.
  4. Seidler, Siegfried; Angelis, Walter G.; Laufer, Wolfgang; Lulic, Francisco Rojo, Apparatus including a heat exchanger and equalizing vessel.
  5. Bosak, Henry C.; Boyd, Thomas A.; Kofstad, Harvey R., Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages.
  6. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Closed-loop microchannel cooling system.
  7. Gardell David L. ; Gaspar Krisztian ; Morin Guy C., Co-axial bellows liquid heatsink for high power module test.
  8. Belady Christian L. ; Cromwell S. Daniel, Cold plate arrangement for cooling processor and companion voltage regulator.
  9. Mok, Lawrence S., Compliant vapor chamber chip packaging.
  10. Phillips Richard J. (Alachua FL) Larson Ralph I. (Bolton MA), Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in sec.
  11. Santiago,Juan G.; Zeng,Shulin, Control of electrolysis gases in electroosmotic pump systems.
  12. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover.
  13. DiGiacomo Giulio ; Iruvanti Sushumna ; Womac David J., Direct chip-cooling through liquid vaporization heat exchange.
  14. Goodson, Kenneth E.; Chen, Chuan-Hua; Huber, David E.; Jiang, Linan; Kenny, Thomas W.; Koo, Jae-Mo; Laser, Daniel J.; Mikkelsen, James C.; Santiago, Juan G.; Wang, Evelyn Ning-Yi; Zeng, Shulin; Zhang, Electroosmotic microchannel cooling system.
  15. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  16. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
  17. Schmidt Roger R. ; Maclachlan William P. ; Horvath Drew R. ; Barringer Dennis R., Enhanced test head liquid cooled cold plate.
  18. Phillips,Alfred L.; Khrustalev,Dmitry K.; Wert,Kevin L.; Wilson,Michael J.; Wattelet,Jonathan P.; Broadbent,John, Flexible loop thermosyphon.
  19. Elmer R. Jones, Flexibly suspended heat exchange head for a DUT.
  20. Ching-Bin Lin TW, Guidably-recirculated heat dissipating means for cooling central processing unit.
  21. John Lee Colbert ; John Saunders Corbin, Jr. ; Roger Duane Hamilton ; Danny E. Massey ; Arvind Kumar Sinha, Heat pipe heat sink assembly for cooling semiconductor chips.
  22. Hsu,Hul Chun, Heat pipe structure and method for fabricating the same.
  23. Thayer, John Gilbert; Schaeffer, Clark Scott; Apicelli, Samuel W., Heat pipe with axial and lateral flexibility.
  24. Thayer, John Gilbert; Schaeffer, Clark Scott; Apicelli, Samuel W., Heat pipe with axial and lateral flexibility.
  25. Ambrose, Jay H.; Holmes, Rolland, Heat pipe with axial wick.
  26. Cromwell Stephen Daniel ; Belady Christian, Heat sink and Faraday Cage assembly for a semiconductor module and a power converter.
  27. Gilliland, Don Alan; Holahan, Maurice Francis; Huettner, Cary Michael, Heat sink apparatus with extendable pin fins.
  28. Ryu,Je hyoung; Kim,Tae gyu; Lee,Jun ho; Lee,Sung jin; Lee,Hong yong, Inspecting apparatus having a radiator to radiate heat from a semiconductor device.
  29. He, Li; Lee, Tsung Lung, Liquid cooling device.
  30. Deng, Tao; Wetzel, Todd Garrett; de Bock, Hendrik Pieter Jacobus; Russ, Boris Alexander, Locking device and method for making the same.
  31. Cromwell S. Daniel ; Nobi Laszlo, Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management.
  32. Cromwell S. Daniel, Method and apparatus for a modular integrated apparatus for multi-function components.
  33. Cromwell S. Daniel, Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules.
  34. Cromwell S. Daniel, Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU).
  35. Viswanath Ram S., Pickup chuck with an integral heat pipe.
  36. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Everett, Jr., George Carl, Power conditioning module.
  37. Gronowicz, Jr., William; Holthus, John, Protective enclosure for a wire harness.
  38. Ching-Bin Lin TW, Self-recirculated heat dissipating means for cooling central processing unit.
  39. Kenny, Jr., Thomas William; Goodson, Kenneth E.; Santiago, Juan G.; Kim, John J.; Chaplinsky, Robert C.; Everett, Jr., George Carl, System including power conditioning modules.
  40. Shyy, Wei; Francois, Marianne Monique; Chung, Jacob Nan-Chu, Thermal management device.
  41. Shyy, Wei; Francois, Marianne Monique; Chung, Jacob Nan-Chu, Thermal management device.
  42. Wilson, James S.; Moore, Michael A., Thermal management system and method for electronic assemblies.
  43. Wilson,James S.; Moore,Michael A., Thermal management system and method for electronic assemblies.
  44. Yang, Hsiu-Wei, Thermal module.
  45. Smith, Dennis Wayne; Hadden, Steven, Thermally-conductive vibration isolators and spacecraft isolation systems employing the same.
  46. Larson Ralph I. (Bolton MA) Phillips Richard J. (Alachua FL), Two-phase component cooler.
  47. Zhou, Feng; Dede, Ercan M.; Asheghi, Mehdi; Palko, James W.; Goodson, Kenneth E., Vapor chamber heat flux rectifier and thermal switch.
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