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A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to the outlet

A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to the outlet decreases from the inlet to the outlet thereby reducing pressure drop without sacrificing thermal performance. The cross-sectional area may be decreased by tilting a top of the housing relative to a bottom, or providing a plurality of fins separated by channels in which the cross-sectional area of the channels decreases from the inlet to the outlet.

대표청구항 ▼

A fluid heat exchanger for cooling an electronic component comprising, a housing for receiving heat from an electronic component, said housing having a fluid inlet and a fluid outlet at opposite ends of the housing, the cross-sectional area perpendicular to the direction of fluid flow in the housing

A fluid heat exchanger for cooling an electronic component comprising, a housing for receiving heat from an electronic component, said housing having a fluid inlet and a fluid outlet at opposite ends of the housing, the cross-sectional area perpendicular to the direction of fluid flow in the housing for conveying fluid from the inlet to the outlet decreasing from the inlet to the outlet, the housing includes a top and a wall, said wall adapted to be positioned adjacent said electronic component in a heat conducting relationship, a plurality of fins, separated by channels, positioned in the housing and connected to the wall, and said top of the housing is spaced from the fins. A fluid heat exchanger for cooling an electronic component comprising, a housing having a base for receiving heat from an electronic component, a top, first and second opposing ends, a fluid inlet at the first end and a fluid outlet at the second end, a plurality of spaced fins, said fins including a top and a bottom, said bottom being connected to the base and extending from the inlet to the outlet, said top of the housing positioned in a non-parallel relationship relative to the tops of the fins, said housing top being closer to the fins at the fluid outlet than at the fluid inlet providing a cross-sectional area in the housing for conveying fluid from the inlet to the outlet decreasing from the inlet to the outlet.