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Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C09C-001/68
출원번호 US-0285435 (1989-03-07)
발명자 / 주소
  • Carr Jeffrey W. (Fishkill NY) David Lawrence D. (Wappingers Falls NY) Guthrie William L. (Hopewell Junction NY) Kaufman Frank B. (Amawalk NY) Patrick William J. (Newburgh NY) Rodbell Kenneth P. (Poug
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 194  인용 특허 : 9

초록

Disclosed is a method of chem-mech polishing an electronic component substrate. The method includes the following steps; obtaining a substrate having at least two features thereon or therein which have a different etch rate with respect to a particular etchant; and contacting the substrate with a po

대표청구항

A chem-mech polishing slurry comprising: abrasive particles; a transition metal chelated salt; and a solvent for said salt.

이 특허에 인용된 특허 (9)

  1. Hori Saburo (Iwaki JPX) Watanabe Nobuhiro (Iwaki JPX), Composite abrasive particles for magnetic abrasive polishing and process for preparing the same.
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  9. Khaladji Jean (Paris FRX) Peltier Marcel (La Rochelle FRX), Rare earth polishing compositions.

이 특허를 인용한 특허 (194)

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