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Method of packaging and powering integrated circuit chips and the chip assembly formed thereby

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
  • H01L-023/48
  • H01L-023/42
  • H01L-039/02
출원번호 US-0373960 (1989-06-29)
발명자 / 주소
  • Fox Leslie R. (Boxborough MA) Wade Paul C. (Shirley MA) Schmidt William L. (Acton MA)
출원인 / 주소
  • Digital Equipment Corp. (Maynard MA 02)
인용정보 피인용 횟수 : 112  인용 특허 : 13

초록

An IC chip assembly includes a chip having an array of exposed contacts at a first face thereof, a substrate having an array of exposed contacts at a face thereof and a compliant interposer with exposed contacts at opposite faces thereof positioned between the chip and substrate so that contacts on

대표청구항

An IC chip assembly comprising a chip having an array of exposed contacts at a face thereof; a substrate having an array of exposed contacts at a face thereof; interposer means positioned between said chip and substrate, said interposer means including electrically insulating compliant means for pro

이 특허에 인용된 특허 (13)

  1. Werbizky George G. (Vestal NY), Circuit module with separate signal and power connectors.
  2. Honn ; James J. ; Stuby ; Kenneth P., Electrical package for LSI devices and assembly process therefor.
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이 특허를 인용한 특허 (112)

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