초록 ▼

The electronic package (10) is comprised of a plurality of support plates (12-24), each of which has a plenum therein and preferably webs extending into the plenum for fluid flow control and heat transfer. A wafer (104) is mounted in a recess (100) in the support plate (12) so that fluid in the plen

The electronic package (10) is comprised of a plurality of support plates (12-24), each of which has a plenum therein and preferably webs extending into the plenum for fluid flow control and heat transfer. A wafer (104) is mounted in a recess (100) in the support plate (12) so that fluid in the plenum (52) directly cools the wafer. Electrical connection is by flexible cable (108) to an exterior printed wiring board (40). The package may have any selected number of support plates, and each support plate may carry one full-sized wafer for compact packaging.

대표청구항 ▼

An electronic package comprising: at least first and second support plates and a bottom support plate, each of said support plates having a support surface thereon, a semiconductor wafer directly supported on said support surface of each of said support plates, each of said support plates having a p

An electronic package comprising: at least first and second support plates and a bottom support plate, each of said support plates having a support surface thereon, a semiconductor wafer directly supported on said support surface of each of said support plates, each of said support plates having a plenum formed therein, said first and second support plates and said bottom support plate being stacked so that said first support plate is on tope of said second support plate so that said plenum of said first support plate directly faces said support surface of said second support plate; a top plate engaging on and covering said first support plate and a bottom plate beneath and covering the bottom of said bottom support plate, said top plate, said support plates and said bottom plate being stacked; a plurality of webs formed in each of said plenums so that aid webs extend toward the support surface of the facing support plate to lie closely adjacent said semiconductor wafer supported on said facing support surface, a resilient adhesive between said webs and said semiconductor wafer so that said semiconductor wafer is supported by said webs on the side of said semiconductor wafer away from said support surface and said webs and said adhesive enclose channels through each plenum over said semiconductor wafers; a fluid opening in said bottom plate, a fluid opening in said top plate, said plenums being arranged so that fluid entering one of said openings passes through said plenums to the other of said openings so that said wafers on said support surfaces are directly in contact with fluid and are cooled by fluid passing through said plenums.