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Washing arrangement for and method of washing lead frames 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-005/00
출원번호 US-0803105 (1985-11-27)
우선권정보 JP-0251968 (1984-11-30)
발명자 / 주소
  • Ishijima Akira (Tokyo JPX) Beppu Toshihiko (Tokyo JPX) Kikuchi Gunpei (Tokyo JPX)
출원인 / 주소
  • Ishijima Industrial Co., Ltd. (both of JPX 03) Ebara Corporation (both of JPX 03)
인용정보 피인용 횟수 : 39  인용 특허 : 2

초록

A washing arrangement for and method of removing burrs of moldable substances from upper and lower major surfaces of lead frames on portions of which the burrs were undesirably applied during molding comprises a transfer assembly which is located outside a washing chamber of the arrangement. The tra

대표청구항

An arrangement for removing burrs of moldable substances from upper and lower major surfaces of lead frames on portions on which the burrs were undesirably applied during molding, said arrangement comprising: (a) washing means, including a washing workstation, for directing washing fluids under pres

이 특허에 인용된 특허 (2)

  1. Bardina, Juan; Gonzalez, Mikel, Decontamination method for semiconductor wafer handling equipment.
  2. Yano Shunji (Sagamihara JPX) Takahashi Tsunehisa (Sagamihara JPX), Method for multi-stage washing.

이 특허를 인용한 특허 (39)

  1. Yokomizo,Kenji, Apparatus and method of securing a workpiece during high-pressure processing.
  2. Goudie Chad ; Natalicio John ; Olsen Greg ; Shurtliff Eric, Apparatus for rinsing wafers in the context of a combined cleaning rinsing and drying system.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  5. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  6. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  7. Jones, William D., High pressure fourier transform infrared cell.
  8. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  9. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  10. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  11. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  12. Warren ; Jr. Waite R. ; Nicholls Lou W., Lead frame dryer.
  13. Mihara Kazuo,JPX, Lead frame processing method and apparatus.
  14. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  15. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  16. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  17. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  18. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  19. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  20. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  21. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  22. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  23. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  24. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  25. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  26. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  27. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  28. Wuester,Christopher D., Process flow thermocouple.
  29. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
  30. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.
  31. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  32. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  33. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
  34. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
  35. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.
  36. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  37. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  38. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  39. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
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