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Epoxy composition of increased thermal conductivity and use thereof 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-007/00
  • C08K-003/22
  • B05D-003/02
출원번호 US-0494807 (1990-03-14)
발명자 / 주소
  • Boyko Christina M. (Conklin NY) Johnston Craig N. (Nicholasville KY) Loomis James R. (Binghampton NY) Samuelson Carl E. (Johnson City NY) Schumacher Ricahrd A. (Endicott NY)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 12  인용 특허 : 29

초록

A composition of enhanced thermal conductivity which comprises a tetrabrominated diglycidyl ether polyepoxide; and epoxy polymer having an epoxy functionality of 3.5 to 6; zinc oxide and curing agents; and use thereof.

대표청구항 ▼

A composition comprising: (A) about 70 to 90 parts per 100 parts by weight of resin solids of a tetrabrominated diglycidyl ether of a phenol polyepoxide; (B) about 10 to about 30 parts per 100 parts by weight of resin solids of an epoxy polymer having functionality of about 3.5 to about 6; (C) abou

이 특허에 인용된 특허 (29)

  1. Kaufman, Lance R., Circuit package with membrane, containing thermoconductive material, ruptured against a heat sink.
    상세보기
  2. Lin Shiow C. (Ellicott City MD), Conductive thermosetting compositions and process for using same.
    상세보기
  3. Tamura Katsuhide (Soka JPX), Electro-optic display device and a method of producing the same.
    상세보기
  4. Funari Joseph (Vestal NY) Green Mary C. (Endicott NY) Reynolds Scott D. (Endwell NY) Sammakia Bahgat G. (Johnson City NY), Electronic package with improved heat sink.
    상세보기
  5. McCaskey Harold O. (Allendale SC) Benson Melvin E. (Varnville SC), Fire-resistant filler sheet laminates.
    상세보기
  6. Flint Ephraim B. (Garrison NY) Grebe Kurt R. (Beacon NY) Gruber Peter A. (Mohegan Lake NY) Zingher Arthur R. (White Plains NY), Flexible finned heat exchanger.
    상세보기
  7. Fushiki Yasuo (Takatsuki JPX) Isshiki Minoru (Otsu JPX) Nakano Hiroshi (Ashiya JPX) Oizumi Masayuki (Otsu JPX) Shimomura Masayoshi (Shiga JPX) Imajo Keiji (Otsu JPX), Glass fiber-reinforced electrical laminates and a continuous production method therefor.
    상세보기
  8. Schoenberg Andrew J. (Huntington NY) Friedrich Marju L. (Babylon NY), Heat activatable adhesive for wire scribed circuits.
    상세보기
  9. Landi Vincent R. (Danielson CT) Fitts Bruce B. (Quinebaug CT), Heat stable phenolic composition containing aramid fibers.
    상세보기
  10. Weidenbenner William A. (Dallas TX) Steltz Irvin J. (North Wales PA), Heat transfer composition and method of making.
    상세보기
  11. Spaight ; Ronald Neil, Heat transfer mechanism for integrated circuit package.
    상세보기
  12. Olson Larry D. (Viroqua WI), Hybrid woven glass cloths.
    상세보기
  13. Schuessler Philipp W. H. (Endwell NY), Method for hermetically sealing an electronic circuit package.
    상세보기
  14. Okada Reisuke (Otsu JPX) Fujino Hisami (Otsu JPX), Method for producing laminate board containing uniformly distributed filler particles.
    상세보기
  15. Hallstrom James R. (Brookfield WI) Hoffman Raymond J. (Fox Point WI) Walling Ronald L. (Sussex WI), Method of applying a wearing surface.
    상세보기
  16. Leibowitz Joseph D. (Culver City CA), Method of fabricating multilayer printed circuit board structure.
    상세보기
  17. Fick Herbert J. (Northfield MN), Method of preparing interfacings of heat sinks with electrical devices.
    상세보기
  18. Hesse Wolfgang (Taunusstein DEX) Rahut Klas (Wiesbaden DEX), Mixture for the production of acid-resistant sealing materials and impregnating materials, a process for their preparati.
    상세보기
  19. DeGree David C. (Burnsville MN) Fick Herbert J. (Northfield MN) Juenger Bruce H. (Northfield MN), Mounting pad for solid-state devices.
    상세보기
  20. Aakalu Nandakumar G. (Poughkeepsie NY) Rittmiller Lawrence A. (Saugerties NY), Non-bleeding thixotropic thermally conductive material.
    상세보기
  21. Carnahan Robert D. (Barrington IL) Holt ; Jr. William C. (Alexandria VA) Youtsey Karl J. (Decatur AL), Polymeric materials containing semiconducting refractory oxides.
    상세보기
  22. Irving Edward (Burwell GB2), Polymerizable compositions containing diphenyliodosyl salts.
    상세보기
  23. Dolch Ronald G. (Budd Lake NJ) Kerr ; Jr. Robert N. (Reading PA), Pressure-sensitive antistatic adhesive and process for the preparation thereof using an aqueous latex copolymer and a qu.
    상세보기
  24. Arachtingi James J. (Massapequa Park NY), Process for bonding metals to electrophoretically deposited resin coatings.
    상세보기
  25. Imai ; Takeshi, Resin-sealed electrical device.
    상세보기
  26. Darrow Russell E. (Newark Valley NY) Memis Irving (Vestal NY) Poliak Richard M. (Endwell NY), Sealing of integrated circuit modules.
    상세보기
  27. Ibata Jyoji (Fuki JPX) Fukui Hisaaki (Nobeoka JPX) Yuasa Takeo (Fuji JPX) Katoh Michio (Fuji JPX), Sheet molding material produced by associating a layer comprising a photopolymerizable material with layers comprising t.
    상세보기
  28. DeGree David C. (Burnsville MN) Fick Herbert J. (Northfield MN) Juenger Bruce H. (Northfield MN), Thermally conductive, electrically insulative laminate.
    상세보기
  29. Leland John E. (Bartlesville OK) Dix James S. (Bartlesville OK) Shue Robert S. (Bartlesville OK), Zinc oxide in poly(arylene sulfide) compositions.
    상세보기

이 특허를 인용한 특허 (12)

  1. Lawton, Ernest L.; Rau, Robert B.; Puckett, Garry D., Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding.
    상세보기
  2. Tungare Aroon Vishwanath ; Richgels Scott Harold ; Kamla Jeffrey Robert ; Conn Peggy Mae, Fillers for improved epoxy laminates.
    상세보기
  3. Bruce E. Novich ; Kami Lammon-Hilinski ; Walter J. Robertson ; Xiang Wu ; Vedagiri Velpari ; Ernest L. Lawton ; William B. Rice, Impregnated glass fiber strands and products including the same.
    상세보기
  4. Lawton, Ernest L.; Velpari, Vedagiri; Rice, William B.; Robertson, Walter J.; Novich, Bruce E.; Wu, Xiang; Lammon-Hilinski, Kami, Impregnated glass fiber strands and products including the same.
    상세보기
  5. Lawton, Ernest L.; Velpari, Vedagiri; Rice, William B.; Robertson, Walter J.; Novich, Bruce E.; Wu, Xiang; Lammon-Hilinski, Kami, Impregnated glass fiber strands and products including the same.
    상세보기
  6. Olson Larry D. (Viroqua WI) Burkhardt Maureen D. (Onalaska WI) Johnson Henry R. (West Salem WI), Laminate board possessing improved dimensional stability.
    상세보기
  7. Lawton, Ernest L.; Rau, Robert, Resin compatible yarn binder and uses thereof.
    상세보기
  8. Rau,Robert B.; Lawton,Ernest L., Resin compatible yarn binder and uses thereof.
    상세보기
  9. Tungare Aroon Vishwanath ; Richgels Scott Harold ; Kamla Jeffrey Robert ; Conn Peggy Mae, Talc particles as fillers for improved epoxy laminates.
    상세보기
  10. Kumar, Sundaram Nand; Sites, Gary; Patel, Bhavik, Thermally and electrically conductive interface.
    상세보기
  11. Kumar, Sundaram Nand; Sites, Gary; Patel, Bhavik, Thermally and electrically conductive interface.
    상세보기
  12. Kumar, Sundaram Nand; Sites, Gary Garvin; Patel, Bhavik, Thermally conductive interface.
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